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首页> 外文期刊>Materials Science and Engineering >Hardness profiles of Sn-3.0Ag-0.5Cu-TiO_2 composite solder by nanoindentation
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Hardness profiles of Sn-3.0Ag-0.5Cu-TiO_2 composite solder by nanoindentation

机译:Sn-3.0Ag-0.5Cu-TiO_2复合焊料的纳米压痕硬度分布

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摘要

Improvement of the hardness values of Sn-3.0Ag-0.5Cu-TiO_2 composite solders with different TiO_2 weight percentages was evaluated by nanoindentation. The composite solders were prepared by ball milling of Sn-3.0Ag-0.5Cu solder with TiO_2 nanoparticles at 300 rpm for 10 min prior to printing and reflowing. Structural analysis indicated that the TiO_2 nanoparticles were successfully blended into the Sn-3.0Ag-0.5Cu solder. Finer Cu_6Sn_5 and Ag_3Sn phases were observed in the composite solder micrographs. The optimum hardness of 1.775 GPa was obtained for the composite solders with a TiO_2 content of 1 wt%. A further increment of the TiO_2 content to 1.5 wt% significantly reduced the hardness value to 1.677 GPa. The hardness profiles were established based on the specific measurement pattern obtained from the nanoindentation. The mechanism of the influence of TiO_2 nanoparticles on the refinement of the intermetallic phases and improvement of the hardness value is also presented.
机译:通过纳米压痕评价了不同TiO_2重量百分比的Sn-3.0Ag-0.5Cu-TiO_2复合焊料硬度值的提高。在印刷和回流之前,先将Sn-3.0Ag-0.5Cu焊料与TiO_2纳米颗粒在300 rpm下球磨10分钟,以制备复合焊料。结构分析表明,TiO_2纳米颗粒已成功掺入Sn-3.0Ag-0.5Cu焊料中。在复合焊料显微图中观察到更细的Cu_6Sn_5和Ag_3Sn相。 TiO_2含量为1 wt%的复合焊料的最佳硬度为1.775 GPa。 TiO_2含量进一步增加到1.5 wt%会明显降低硬度值到1.677 GPa。基于从纳米压痕获得的特定测量图案建立硬度分布。提出了TiO_2纳米粒子影响金属间相细化和提高硬度值的机理。

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  • 来源
    《Materials Science and Engineering》 |2016年第4期|178-186|共9页
  • 作者单位

    School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300, Nibong Tebal, Pulau Pinang, Malaysia;

    Jabil Circuit Sdn. Bhd., Bayan Lepas Industrial Park, 11900, Bayan Lepas, Pulau Pinang, Malaysia;

    Jabil Circuit Sdn. Bhd., Bayan Lepas Industrial Park, 11900, Bayan Lepas, Pulau Pinang, Malaysia;

    Department of Materials Engineering, Celal Bayar University, Manisa 45140, Turkey;

    School of Aerospace Engineering, Universiti Sains Malaysia, 14300, Nibong Tebal Pulau Pinang, Malaysia;

    School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, 14300, Nibong Tebal, Pulau Pinang, Malaysia;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Titanium dioxide; SAC305; Composite solder; Hardness; Nanoindentation;

    机译:二氧化钛;SAC305;复合焊料硬度;纳米压痕;

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