Crack propagation in silicon nitride ceramics under various temperatures and grain boundary toughness

著录项

• 来源
  《Materials Science and Engineering》 |2015年第24期|58-61|共4页
• 作者

  Sai Wei; Lukas W. Porz; Zhipeng Xie; Bin Liu; Juan Chen; Weijiang Xue; Jiamin Zhao;

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• 作者单位

  State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;

  Institute of Materials Science, Darmstadt University of Technology, Darmstadt 64287, Germany;

  State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;

  Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China;

  State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;

  State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;

  Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China;

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• 收录信息
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Crack propagation; Temperature; Grain boundaries; Silicon nitride; Fracture mode;

  机译：裂纹扩展;温度;晶界氮化硅;断裂模式;