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Size-dependent fracture properties of cracked silicon nanofilms

机译：裂纹硅纳米膜的尺寸依赖性断裂特性

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摘要

We evaluate the applicability of the critical energy release rate as a crack propagation criterion with a focus on the effect of the material size. Cracked silicon nanofilms of various thicknesses under uniaxial tensile loading are simulated to examine the influence of film thickness on the critical energy release rate. Tensile stress-strain curves in addition to the atomic configurations corresponding to different strain levels are presented to elucidate the deformation mechanism. The cracked silicon nanofilms subjected to mode I loading deform nonlinearly to some extent The critical energy release rates are calculated by three approaches: a molecular statics simulation, the Griffith criterion, and linear elastic fracture mechanics. Results obtained from these three methods are compared with each other and the differences between them are discussed. The critical energy release rate may be capable of predicting crack propagation when the silicon nanofilms are thicker than approximately 18 nm.
机译：我们评估临界能量释放速率作为裂纹扩展标准的适用性，重点是材料尺寸的影响。模拟在单轴拉伸载荷下各种厚度的破裂的硅纳米膜，以检查膜厚度对临界能量释放速率的影响。除了对应于不同应变水平的原子构型以外，还给出了拉伸应力-应变曲线，以阐明变形机理。处于模式I加载的破裂的硅纳米膜在某种程度上非线性变形。临界能量释放速率通过三种方法计算：分子静态模拟，格里菲斯准则和线性弹性断裂力学。比较这三种方法获得的结果，并讨论它们之间的差异。当硅纳米膜的厚度大于约18 nm时，临界能量释放速率可能能够预测裂纹扩展。

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