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Strain rate effect on plastic deformation of nanocrystalline copper investigated by molecular dynamics

机译:分子动力学研究应变速率对纳米晶铜塑性变形的影响

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The strain rate effect on the plastic deformation of nanocrystalline copper with mean grain sizes in the range of 3.8-27.3 nm has been investigated by using molecular dynamics simulation. The simulated results indicate that the critical mean grain size corresponding to the transition of plastic deformation mechanism is little influenced by the strain rate in the strain-rate range of 1 × 10~7 -1 × 10~(10) s~(-1) The simulated grain-size dependence of the strain rate sensitivity for strain rate below 1 × 10~8 s~(-1) is in agreement with the experimental results of nanocrystalline copper reported in literatures. The strain rate sensitivity values for the simulated samples with mean grain sizes of 3.8 and 5.5 nm are 0.073 and 0.065 respectively. These results reveal that the stress-driven grain-boundary plastic deformation mechanisms such as grain-boundary sliding and migration are not as sensitive to strain rate as that expected for the thermally assisted mechanisms. Furthermore it is found that if the stacking faults act as obstacles to the motion of partial dislocations the strain rate sensitivity will increase.
机译:通过分子动力学模拟研究了应变速率对平均晶粒尺寸在3.8-27.3 nm范围内的纳米晶铜塑性变形的影响。仿真结果表明,在1×10〜7 -1×10〜(10)s〜(-1)的应变率范围内,应变速率对塑性变形机理转变的临界平均晶粒尺寸影响很小。 )应变速率敏感性低于1×10〜8 s〜(-1)的模拟晶粒尺寸依赖性与文献报道的纳米晶铜的实验结果一致。平均晶粒尺寸为3.8和5.5 nm的模拟样品的应变速率敏感度值分别为0.073和0.065。这些结果表明,应力驱动的晶界塑性变形机制(如晶界滑动和迁移)对应变率的敏感性不如热辅助机制所预期的那样。此外,还发现,如果堆垛层错成为部分位错运动的障碍,应变率敏感性将增加。

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