Dynamic crack propagation in copper bicrystals grain boundary by atomistic simulation

Yanguang Zhou; Zhenyu Yang; Zixing Lu

首页> 外文期刊>Materials Science and Engineering >Dynamic crack propagation in copper bicrystals grain boundary by atomistic simulation

【24h】

Dynamic crack propagation in copper bicrystals grain boundary by atomistic simulation

机译：原子模拟在双晶铜晶界中动态裂纹扩展

获取原文

获取原文并翻译 | 示例

掌桥外文数据库（机构版） >>

开具论文收录证明 >>

文献代查 >>

页面导航

摘要
著录项
相似文献
相关主题

摘要

Grain boundaries (GBs) dependent crack propagation has been observed in previous experiments, which shows strong anisotropy of cracks propagation behaviors in nanocrystalline. In this paper, the propagation behaviors of central cracks at different symmetrical tilt GBs in bicrystalline copper are studied by using atomistic simulations. Three different modes of interfacial crack propagation are found: crack prefers to propagate in a brittle manner along GB; crack propagates with voids and coalescence ahead of the crack tip, and blunts in the opposite direction; crack blunts at both two tips of the crack. Furthermore, thermo effects on the crack propagation are also investigated in our simulations. It is found that the mode of crack propagation at a certain GB changes from brittle to ductile at a critical temperature, which is different for the GB with different crystalline structures.

机译：在先前的实验中已经观察到晶界（GBs）相关的裂纹扩展，这表明纳米晶中裂纹扩展行为具有很强的各向异性。本文利用原子模拟研究了双晶铜在不同对称倾斜GBs下中心裂纹的扩展行为。发现了三种不同的界面裂纹扩展方式：裂纹更倾向于沿GB脆性扩展。裂纹在裂纹尖端之前以空隙和聚结的形式传播，并在相反的方向钝化。裂纹在裂纹的两个尖端均变钝。此外，在模拟中还研究了热对裂纹扩展的影响。发现在一定温度下裂纹的扩展模式在临界温度下从脆性变为延性，这对于具有不同晶体结构的GB是不同的。

著录项

来源
《Materials Science and Engineering》 |2014年第2期|116-124|共9页
作者
Yanguang Zhou; Zhenyu Yang; Zixing Lu;
展开▼
作者单位

Institute of Solid Mechanics, Beihang University (BUM), Beijing 100191, PR China;

Institute of Solid Mechanics, Beihang University (BUM), Beijing 100191, PR China;

Institute of Solid Mechanics, Beihang University (BUM), Beijing 100191, PR China;

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类
关键词
Dynamic crack propagation; Grain boundary; Brittle to ductile; Thermo effects; Molecular dynamics;

机译：动态裂纹扩展;晶界;脆到延展;热效应;分子动力学;

相似文献

外文文献
中文文献
专利

1. Molecular dynamics simulation of crack tip blunting in opposing directions along a symmetrical tilt grain boundary of copper bicrystal [J] . A. LUQUE, J. ALDAZABAL, J. M. MARTINEZ-ESNAOLA, Fatigue & Fracture of Engineering Materials & Structures . 2007,第11期

机译：裂纹尖端沿双晶铜对称倾斜晶界向相反方向钝化的分子动力学模拟
2. Atomistic simulations on intergranular fracture toughness of copper bicrystals with symmetric tilt grain boundaries [J] . Cui Cheng Bin, Beom Hyeon Gyu Metals and Materials International . 2018,第1期

机译：对称倾斜晶界铜双晶体晶间断裂韧性的原子模拟
3. Atomistic simulations of shock induced melting of bicrystal copper with twist grain boundary [J] . He A. M., Duan Suqing, Shao Jian-Li, Journal of Applied Physics . 2012,第10期

机译：扭曲晶界冲击诱发双晶铜熔化的原子模拟
4. Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal under Tensile and Shear Deformation [C] . Liang. Zhang, Cheng. Lu, Kiet. Tieu Materials Research Society Meeting . 2014

机译：拉伸剪切变形下铜双晶晶界σ5晶界的分子动力学模拟
5. Identification of atomistic mechanisms for grain boundary migration in [001] twist boundaries: Molecular dynamics simulation [D] . Yan, Xinan 2009

机译：识别[001]扭曲边界中晶界迁移的原子机理：分子动力学模拟
6. Atomistic Simulation of Tensile Deformation Behavior of ∑5 Tilt Grain Boundaries in Copper Bicrystal [O] . Liang Zhang, Cheng Lu, Kiet Tieu -1

机译：双晶铜中∑5倾斜晶界拉伸变形行为的原子模拟
7. Atomistic Simulation of Tensile Deformation Behavior of ∑5 Tilt Grain Boundaries in Copper Bicrystal [O] . Liang Zhang, Cheng Lu, Kiet Tieu 2014

机译：Σ5倾斜晶界铜桥梁拉伸变形行为的原子模拟
8. Numerical Simulation of Static and Dynamic Shadow Patterns Using an Atomistic Description of Crack Initiation and Propagation [R] . Moran, B., Hoover, W. G., Norris, D. M. 1984

机译：用裂纹萌生和传播原子描述静态和动态阴影模式的数值模拟

Dynamic crack propagation in copper bicrystals grain boundary by atomistic simulation

摘要

著录项

相似文献

相关主题

期刊订阅