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Recycling of AlSi8Cu3 alloy chips via high pressure torsion

机译:通过高压扭力回收AlSi8Cu3合金屑

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摘要

In this paper, AlSi8Cu3 alloy chips were consolidated via HPT at an applied pressure 8 GPa for 10 revolutions at room temperature. The microstructure and hardness of the HPT consolidated chips were investigated and compared with those of the HPT processed solid AlSi8Cu3 alloy samples and cold compacted chip samples. The HPT process successfully resulted in fully densified bulk samples with a higher microhardness due to the finer Al matrix grains and Si particles sizes with more grain boundaries with high angles and more homogeneous deformation than those in the HPT processed solid AlSi8Cu3 alloy samples due to the higher imposed total strain.
机译:在本文中,通过在室温下施加8 GPa的压力10圈,通过HPT固结AlSi8Cu3合金切屑。研究了HPT固结切屑的微观结构和硬度,并将其与HPT处理的固体AlSi8Cu3合金样品和冷压切屑样品的微观结构和硬度进行了比较。 HPT工艺成功地导致了完全致密化的块状样品,其具有更高的显微硬度,这是由于与HPT加工的固态AlSi8Cu3合金样品相比,Al基细晶粒和Si颗粒尺寸更大,具有更大的角度和更大的均质变形,从而具有更高的显微硬度。施加总应变。

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