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Effects of nano-scale grain boundaries in Cu on its Bauschinger's effect and response to cyclic deformation

机译：铜中纳米晶界对其包辛格效应和循环变形响应的影响

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摘要

Influence of nano-scale grain boundaries (GB) on the mechanical behavior and Bauschinger's effect in copper during cyclic loading, in comparison with those of Cu single crystal (SC) and Cu with nano-scale twin boundaries (TW), was computationally investigated employing the molecular dynamics simulation technique. It was shown that Bauschinger's effect in the nano-systems was gradually weakened in the following order: SC, GB and TW. The annihilation of dislocations or partial dislocations with opposite signs and the shrinkage/extension of associated stacking faults upon stress reversal were mainly responsible for Bauschinger's effect in the nano-copper systems. The cyclic loading process increased the failure strain of the GB, TW and SC systems. However, the increase in the failure strain was less profound in the GB and TW systems. This could be attributed to the fact that both the grain and twin boundaries can block the dislocation movement and stacking fault extension, resulting in higher stress concentration at the boundaries to promote failure.
机译：与铜单晶（SC）和具有纳米级双晶界（TW）的Cu相比，研究了纳米晶界（GB）对铜的力学行为和鲍辛格效应的影响。分子动力学模拟技术。结果表明，鲍辛格在纳米系统中的作用按以下顺序逐渐减弱：SC，GB和TW。具有相反符号的位错或部分位错的ni没以及应力逆转时相关的堆垛层错的收缩/延伸主要是鲍辛格在纳米铜系统中的作用。循环加载过程增加了GB，TW和SC系统的破坏应变。但是，在GB和TW系统中，破坏应变的增加幅度不大。这可能归因于这样一个事实，即晶界和孪晶界都可以阻止位错运动和堆积断层延伸，从而导致边界处的应力集中更高，从而促进破坏。

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