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Formation of Ag_3Sn plates in SnAgCu solder bumps

机译：SnAgCu焊料凸块中Ag_3Sn板的形成

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摘要

Special experiments are designed to obtain the solid reactants directly from a liquid solder during phase transformation. Series of such tests performed throughout reflow, which enables to investigate the entire formation process of intermetallic Ag_3Sn plates out of liquid SnAgCu solder bumps. The results show that Ag_3Sn plates are formed first in the middle of the cooling stage. In the plane, they have two preferable growth directions. By varying thermal conditions during reflow, the formation mechanism of these plates is discussed.
机译：设计了特殊的实验，以在相变过程中直接从液态焊料中获得固体反应物。在整个回流焊过程中进行了一系列此类测试，从而能够研究液态SnAgCu焊料凸点形成的金属间Ag_3Sn板的整个形成过程。结果表明，Ag_3Sn板首先在冷却阶段的中间形成。在飞机上，它们有两个优选的生长方向。通过改变回流过程中的热条件，讨论了这些板的形成机理。

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  • 来源
    《Materials Science and Engineering》 |2010年第11期|2588-2591|共4页
  • 作者

    Jicheng Gong; Changqing Liu; Paul P.Conway; Vadim V.Silberschmidt;

  • 作者单位

    Department of Materials, University of Oxford, Parks Road, Oxford, 0X1 3PH, UK;

    Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK;

    Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK;

    Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, LE11 3TU, UK;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    solder; solidification; crystal growth; intermetallics;

    机译：焊料;凝固;晶体生长金属间化合物;

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