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Change in microstructures and mechanical properties during deep wire drawing of copper

机译：铜深拉拔过程中组织和力学性能的变化

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摘要

Evolution of microstructure and change in mechanical properties of a pure copper wire deformed to equivalent strain of 6.9 by deep wire-drawing (WD) process were investigated and compared with those in a copper sheet severely deformed by accumulative roll bonding (ARB) process. The deep-drawn copper had an ultrafine and elongated microstructure with mean high-angle grain boundary (HAGB) spacing of 380 nm. The fraction of HAGBs in the ultrafine microstructure was 62% and the elongated ultrafine grains involved dislocation substructures inside. The microstructural parameters in the WD copper at large strains were similar to those in the copper sheet ARB processed to large strains, though there were minor differences in the microstructure evolution between two processes due to small one-pass strain in the WD process. The tensile strength of the copper wire drawn to an equivalent strain of 6.9 reached 460 MPa, which was two times higher than that of the initial material. The strength of the deep-drawn wire was almost the same as that of the ARB processed copper deformed to the similar amount of strain. Uniform elongations of the WD and ARB specimens were both 1-3%, but the yield strength of the WD specimens decreased and the uniform elongation slightly increased with increasing equivalent strain applied in wire drawing. The electric conductivities of the WD specimens slightly decreased with increasing equivalent strain, and reached the value of 96.5%IACS at ε~(WD)= 6.9. The amount of change in electric conductivity during drawing process was approximately 3%IACS. Therefore, it could be concluded that deep wire drawing does not lower the electric conductivity of the copper wire so much. It was confirmed in the present investigations that the deep WD process acted as a kind of severe plastic deformation process to produce ultrafine microstructures in copper.
机译：研究了通过深拉丝（WD）工艺变形至等效应变6.9的纯铜线的微观结构演变和机械性能的变化，并将其与通过累积辊压结合（ARB）工艺严重变形的铜板中的变形进行了比较。深冲铜具有超细且细长的微观结构，平均高角度晶界（HAGB）间距为380 nm。 HAGBs在超细微结构中的比例为62％，细长的超细晶粒涉及内部的位错亚结构。 WD铜在大应变下的微观结构参数与铜板ARB的大应变相似，尽管由于WD过程中的单程应变小，两个过程之间的微观结构演变差异很小。当量为6.9的铜线的抗拉强度达到460 MPa，是初始材料的两倍。深拉线的强度几乎与经ARB处理的铜变形至相似的应变量时相同。 WD和ARB试样的均匀伸长率均为1-3％，但WD试样的屈服强度降低，而均匀伸长率随拉丝时施加的等效应变的增加而略有增加。 WD试样的电导率随等效应变的增加而略有降低，在ε〜（WD）= 6.9时达到96.5％IACS。拉伸过程中电导率的变化量约为3％IACS。因此，可以得出这样的结论：深拉丝不会大大降低铜线的电导率。目前的研究证实，深部WD工艺是一种严重的塑性变形工艺，可在铜中产生超细微结构。

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