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Formation of dendritic nanostructures in Pyrex glass anodically bonded to silicon coated with an aluminum thin film

机译:在耐热玻璃中阳极键合到涂有铝薄膜的硅上形成树枝状纳米结构

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摘要

Anodic bonding with thin films of metal or alloy as an intermediate layer, finds increasing applications in microanoelectromechanical systems. At the bonding temperature of 350℃, voltage of 400 V, and 30 min duration, the anodic bonding is completed between Pyrex glass and crystalline silicon coated with an aluminum thin film with a thickness comprised between 50 and 230 nm. Sodium-depleted layers and dendritic nanostructures were observed in Pyrex 7740 glass adjacent to the bonding interface. The sodium depletion width does not increase remarkably with the thickness of aluminum film. The dendritic nanostructures result from aluminum diffusion into the Pyrex glass. This experimental research is expected to enhance the understanding of how the depletion layer and dendritic nanostructures affect the quality of anodic bonding.
机译:以金属或合金薄膜作为中间层的阳极键合在微/纳米机电系统中的应用越来越广泛。在350℃,400 V的电压和30分钟的持续时间下,Pyrex玻璃与涂有厚度为50至230 nm的铝薄膜的晶体硅之间完成阳极键合。在靠近粘结界面的Pyrex 7740玻璃中观察到了贫钠层和树枝状纳米结构。钠消耗宽度不会随着铝膜的厚度而显着增加。树枝状纳米结构是由铝扩散到派热克斯玻璃中产生的。预期该实验研究将增强对耗尽层和树枝状纳米结构如何影响阳极键合质量的理解。

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