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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Atomistic analysis of discontinuous deformation during cutting processes
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Atomistic analysis of discontinuous deformation during cutting processes

机译：切削过程中不连续变形的原子分析

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摘要

The aim of this work was to analyze the influence of the micro-structural properties on the nanometer level material removal process. For this purpose atomistic models for a ductile and a semi-brittle metal were set up and molecular dynamics simulations were performed. The ductile material showed a discontinuous cyclic process for the chosen orientation, where chip formation and pre-deformation zone growth alternated at a 90 ps period. For the semi-brittle material, the process is governed by a strong localization of the deformation to the contact area and a cyclic change of the chip cross-section at a period of about 120 ps.
机译：这项工作的目的是分析微观结构特性对纳米级材料去除过程的影响。为此，建立了韧性金属和半脆性金属的原子模型，并进行了分子动力学模拟。韧性材料在选定的方向上显示出不连续的循环过程，其中切屑形成和预变形区的生长以90 ps的周期交替出现。对于半脆性材料，该过程受变形在接触区域的强烈局限性以及切屑横截面在约120 ps的周期内周期性变化的支配。

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