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Correlation mechanism of grain orientation/microstructure and mechanical properties of Cu-Ni-Si-Co alloy

机译：Cu-Ni-Co-Co合金晶粒取向/微观结构的相关机制和机械性能

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摘要

The relationship between the microstructure and properties of the different orientations of a Cu-Ni-Si-Co alloy was investigated by tensile testing, X-ray diffraction electron backscattering diffraction, transmission electron microscopy, and high-energy X-ray diffraction (HEXRD). The results revealed that the cold-rolled alloy contained mainly a Brass {110}<112> and R {124}<211> texture. The alloy was aged, and it exhibited mainly an R texture, and its volume and distributing width were 45.2% and 10.8°, respectively. The aged alloy exhibited obvious anisotropy, and its tensile strength and electrical conductivity in the rolling direction were 870 MPa and 50% IACS, respectively. In the Cu-Ni-Si-Co alloy, the orientation grains close to the [111] crystal plane were in the hard orientation zone, the Schmid factor value was low, and the material strength was relatively high. At the same time, the [111] crystal plane was close-packed and exhibited good conductivity. The oriented grains close to the [100] crystal plane was in the soft oriented zone and had lower strength and conductivity. Through HEXRD analysis, it was found that the oriented grains with a high twin stacking-fault probability had lower stacking fault energy, and the probability of aging-induced twinning was high.
机译：通过拉伸试验研究了Cu-Ni-Si-Co合金的不同取向的微观结构和性能之间的关系，X射线衍射电子背散射衍射，透射电子显微镜和高能X射线衍射（六角） 。结果表明，冷轧合金主要含有黄铜{110} <112>和r {124} <211>纹理。合金老化，其主要表现出r质地，其体积分配宽度分别为45.2％和10.8°。老化合金表现出明显的各向异性，其拉伸方向的拉伸强度和电导率分别为870MPa和50％IACS。在Cu-Ni-Si-Co合金中，靠近[111]晶体平面的取向颗粒在硬取向区中，施霉素值低，材料强度相对较高。同时，[111]晶体平面近填充并表现出良好的电导率。靠近[100]晶平面的取向晶体在柔软的区域中，具有较低的强度和导电性。通过六进分分析，发现具有高孪生堆叠故障概率的定向晶体具有较低的堆叠故障能量，衰老诱导的Twinning的概率很高。

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  • 来源
    《Materials Science and Engineering》 |2021年第13期|141239.1-141239.14|共14页
  • 作者

    He Wei; Yinli Chen; Yina Zhao; Wei Yu; Lan Su; Di Tang;

  • 作者单位

    Collaborative Innovation Center of Steel Technology University of Science and Technology Beijing Beijing 100083 China Beijing Laboratory of Metallic Materials and Processing for Modern Transportation Beijing 100083 China;

    Collaborative Innovation Center of Steel Technology University of Science and Technology Beijing Beijing 100083 China Beijing Laboratory of Metallic Materials and Processing for Modern Transportation Beijing 100083 China;

    Collaborative Innovation Center of Steel Technology University of Science and Technology Beijing Beijing 100083 China Beijing Laboratory of Metallic Materials and Processing for Modern Transportation Beijing 100083 China;

    Engineering Research Institute University of Science and Technology Beijing Beijing 100083 China;

    Collaborative Innovation Center of Steel Technology University of Science and Technology Beijing Beijing 100083 China Beijing Laboratory of Metallic Materials and Processing for Modern Transportation Beijing 100083 China;

    Collaborative Innovation Center of Steel Technology University of Science and Technology Beijing Beijing 100083 China Beijing Laboratory of Metallic Materials and Processing for Modern Transportation Beijing 100083 China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Cu-Ni-Si-Co alloy; Texture; Physical properties; Schmid factor; Twin stacking-fault probability;

    机译：Cu-Ni-Si-Co合金;质地;物理性质;施密因素;双堆叠故障概率;

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