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首页> 外文期刊>Materials Science and Engineering >Microstructural evolution, bonding mechanism and mechanical properties of AlCoCrFeNi_(2.1) eutectic high entropy alloy joint fabricated via diffusion bonding
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Microstructural evolution, bonding mechanism and mechanical properties of AlCoCrFeNi_(2.1) eutectic high entropy alloy joint fabricated via diffusion bonding

机译：通过扩散键合制造的AlcoCrfeni_（2.1）共晶高熵合金接头的微结构演化，粘接机理和力学性能

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摘要

Eutectic high entropy alloys exhibit both high strength and remarkable plasticity. To explore their potential engineering applications, AlCoCrFeNi_(2.1) eutectic high entropy alloy was diffusion bonded, and the element diffusion behavior, interfacial microstructure evolution and mechanical properties of the resultant joints were studied. With the increase of bonding temperature, the voids gradually decreased and the dominant mechanism of voids disappearance transformed from interfacial diffusion to viscoplastic deformation. While increasing the bonding temperature to 1050 °C, the interface disappeared and a continuous solid solution structure formed at the original interface, which was beneficial for improving the joint strength. Meanwhile, the voids still existed at the interface near the B2 phase due to the synergistic effect of low diffusion rate of elements and inferior plasticity in B2 phase. The shear strength of the joints increased and the fracture mode gradually transformed from brittle fracture to ductile fracture with increasing the temperature. The highest shear strength joint of 648 MPa could be obtained at 1050 °C, which was equal to that of base metal, and the uncoordinated deformation between FCC phase and B2 phase resulted in the appearance of cleavage planes and dimples on the fracture surface at 1000 °C.
机译：共晶的高熵合金具有高强度和显着的可塑性。为了探讨其潜在的工程应用，AlcoCrofeni_（2.1）共晶高熵合金是扩散键合的，研究了所得关节的元素扩散行为，界面微观结构演化和机械性能。随着粘合温度的增加，空隙逐渐降低，并且从界面扩散转化为粘液变形的空隙消失的显性机制。在将键合温度增加到1050℃的同时，界面消失，并且在原始界面处形成连续的固溶结构，这是有利于改善关节强度的有益。同时，由于元素低扩散速率和B2相中的劣质性能的协同效应，空隙仍然存在于B2相附近的界面处。接头的剪切强度增加，断裂模式随着温度的增加而从脆性断裂逐渐转化为韧性骨折。在1050℃下可以获得648MPa的最高剪切强度接头，其等于基础金属的1050℃，并且FCC阶段和B2阶段之间的不开样变形导致裂缝的外观和骨折表面上1000 °C。

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  • 来源
    《Materials Science and Engineering》 |2021年第13期|141211.1-141211.17|共17页
  • 作者

    Peng Li; Haotian Sun; Honggang Dong; Yueqing Xia; Shuai Wang; Xiaohu Hao;

  • 作者单位

    School of Materials Science and Engineering Dalian University of Technology Dalian 116024 PR China;

    School of Materials Science and Engineering Dalian University of Technology Dalian 116024 PR China;

    School of Materials Science and Engineering Dalian University of Technology Dalian 116024 PR China;

    School of Materials Science and Engineering Dalian University of Technology Dalian 116024 PR China;

    School of Materials Science and Engineering Dalian University of Technology Dalian 116024 PR China;

    School of Materials Science and Engineering Dalian University of Technology Dalian 116024 PR China;

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  • 原文格式 PDF
  • 正文语种 eng
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  • 关键词

    Diffusion bonding; High entropy alloy; Microstructure evolution; Mechanical properties; Bonding mechanism;

    机译：扩散键合;高熵合金;微观结构演变;机械性能;粘接机制;

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