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首页> 外文期刊>Materials Science and Engineering >An in-situ electron backscattering diffraction and viscoplastic self-consistent study of OFHC copper subjected to uniaxial tension
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An in-situ electron backscattering diffraction and viscoplastic self-consistent study of OFHC copper subjected to uniaxial tension

机译:原位电子反向散射衍射和粘塑性自我一致的OFHC铜对单轴张力的影响

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摘要

In-situ electron backscattering diffraction was used to track microstructure and texture development in poly-crystalline copper during uniaxial tension. Characteristic of face-centred-cubic materials, copper develops a double fibre texture comprising a relatively strong <111> fibre and a weak <100> fibre parallel to the tensile axis. The observation of small stacking faults via transmission electron microscopy indicates that partial slip contributes to strain accommodation during uniaxial tension. The visco-plastic self-consistent model was applied to simulate the macroscopic stress-strain curve and crystallographic texture development by considering the effects of the grain-matrix interaction mode, latent hardening, perfect and partial slip. The simulations demonstrate that an intermediate grain-matrix interaction scheme coupled with weak latent hardening, dominant perfect slip and limited partial slip returns the best agreement between the experimental and simulated textures.
机译:原位电子反向散射衍射用于在单轴张力期间追踪聚结晶铜中的微观结构和质地发育。 面为中心立方体材料的特征,铜开发了一种双纤维纹理,其包含相对较强的<111>纤维和平行于拉伸轴的弱<100>纤维。 通过透射电子显微镜观察小型堆叠故障表明,在单轴张力期间,部分滑移有助于应变住宿。 应用粘料塑料自洽模型来模拟宏观应力 - 应变曲线和晶体纹理开发,考虑晶粒矩阵相互作用模式,潜在的硬化,完美和部分滑动的影响。 该模拟表明,中间晶粒矩阵相互作用方案与弱潜伏的硬化,显性完美滑动和有限的部分滑动返回了实验和模拟纹理之间的最佳协议。

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