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Homogeneous dispersion of graphene and interface metallurgical bonding in Sn-Ag-Cu alloy induced by ball milling

机译：石墨烯和界面冶金键合在球磨机诱导的Sn-Ag-Cu合金中的均匀分散

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摘要

The addition of graphene is expected to improve the properties of solder and graphene reinforced Sn-Ag-Cu (GNSs/SAC) is considered to be able to adapt to harsh service environment. However, it is difficult to realize homogeneous dispersion of reinforcement and the metallurgical bonding between graphene and Sn-Ag-Cu alloys. In this study, composite solders with various dispersion of graphene have been prepared by different ball milling method. The microstructure characterization shows that incoherent interface and amorphous interface have been produced between graphene and Sn. The results of Energy Dispersive Spectrometer (EDS) and X-ray diffraction (XRD) indicate that the interstitial solid solution of carbon atoms in β-Sn is the cause of metallurgical bonding. The relative amount of the two types of interfaces and the dispersion of graphene were evaluated. The incoherent interface of composites tends to form at lower milling speed, and its thermal expansion response indicates that the interface has more effective load transfer, while the amorphous interface is opposite. Besides, the {101} fiber texture was also confirmed to be formed during ball milling and sintering. Finally, the nano indentation test verified the metallurgical bond, and the mechanical properties of the GNSs/SAC composites are determined by the interface type and graphene dispersion.
机译：预计将加入石墨烯将改善焊料和石墨烯增强的Sn-Ag-Cu（GNSS / SAC）的性质被认为能够适应恶劣的服务环境。然而，难以实现加固和石墨烯和Sn-Ag-Cu合金之间的冶金键合的均匀分散。在该研究中，通过不同的球磨方法制备了具有各种石墨烯分散的复合焊料。微观结构表征显示，石墨烯和Sn之间的非角膜界面和非晶界面。能量分散光谱仪（EDS）和X射线衍射（XRD）的结果表明β-Sn中碳原子的间质固体溶液是冶金键合的原因。评估两种类型的界面的相对量和石墨烯的分散体。复合材料的不连贯界面倾向于以较低的研磨速度形成，其热膨胀响应表明界面具有更有效的负载转移，而无定形界面相反。此外，还证实在球磨和烧结期间形成{101}光纤纹理。最后，纳米缩进试验验证了冶金键，通过界面类型和石墨烯分散来确定GNSS / SAC复合材料的机械性能。

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  • 来源
    《Materials Science and Engineering》 |2021年第8期|141823.1-141823.8|共8页
  • 作者

    Yuan Li; Lianyong Xu; Hongyang Jing; Lei Zhao; Yongdian Han;

  • 作者单位

    School of Materials Science and Engineering Tianjin University Tianjin 300350 China Tianjin Key Laboratory of Advanced Joining Technology Tianjin 300350 China;

    School of Materials Science and Engineering Tianjin University Tianjin 300350 China Tianjin Key Laboratory of Advanced Joining Technology Tianjin 300350 China;

    School of Materials Science and Engineering Tianjin University Tianjin 300350 China Tianjin Key Laboratory of Advanced Joining Technology Tianjin 300350 China;

    School of Materials Science and Engineering Tianjin University Tianjin 300350 China Tianjin Key Laboratory of Advanced Joining Technology Tianjin 300350 China;

    School of Materials Science and Engineering Tianjin University Tianjin 300350 China Tianjin Key Laboratory of Advanced Joining Technology Tianjin 300350 China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Graphene; Sn-Ag-Cu alloy; Metallurgical bonding; Interface formation mechanism; Dispersion;

    机译：石墨烯;Sn-Ag-Cu合金;冶金粘合;界面形成机制;分散;

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