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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >Reliability of Sn-Ag-Sb lead-free solder joints
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Reliability of Sn-Ag-Sb lead-free solder joints

机译：Sn-Ag-Sb无铅焊点的可靠性

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摘要

The effect of Sb contents (0-10 wt percent) on the reliability of Sn-Ag-Sb solder has been investigated with isothermal low cycle mechanical fatigue tests. The solders tested were Sn-3.5Ag with Sb contents of 1.73, 3.85, 5.12 and 10.05 wt percent, respectively, in the form of solder balls. Single-lap specimens were used to simulate real solder joints with the solder balls reflowed between two pure Cu substrates. Experimental results showed that under a fixed controlled displacement of 0.025 mm, fatigue life of the as-soldered joint increased with the amount of Sb additions due to less plastic strain the hardened solders produced. Load drop rate in the final stage increased as Sb addition increased. Fatigue cracks initiated at locations between the neck of the hourglass-shaped solder joint and the intermetallic compound (IMC) layer formed between the solder and copper. With the increase of Sb contents, the fracture mode evolved from within the bulk solder to a mixed fracture mode of solder and IMC layer, and finally, along the IMC layer.
机译：通过等温低循环机械疲劳试验研究了Sb含量（0-10 wt％）对Sn-Ag-Sb焊料可靠性的影响。所测试的焊料是锡球形式的Sb含量分别为1.73、3.85、5.12和10.05 wt％的Sn-3.5Ag。单圈试样用于模拟真实的焊点，其中焊球在两个纯铜基板之间回流。实验结果表明，在0.025 mm的固定受控位移下，焊接后的接头的疲劳寿命随着Sb的添加而增加，这是因为所产生的硬化焊料的塑性应变较小。随着Sb添加量的增加，最后阶段的负载下降率增加。疲劳裂纹在沙漏形焊点的颈部与焊锡和铜之间形成的金属间化合物（IMC）层之间的位置处引发。随着Sb含量的增加，断裂模式从块状焊料内部演变为焊料和IMC层的混合断裂模式，最后沿着IMC层。

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