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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing >A probabilistic model for prediction of bonding time in diffusion bonding
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A probabilistic model for prediction of bonding time in diffusion bonding

机译：扩散键合时间预测的概率模型

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摘要

A probabilistic model for prediction of bonding time in diffusion bonding is presented based on the stochastic characteristics of surface finish of bonded area. The probabilistic distribution of surface roughness is introduced into a deterministic model of diffusion bonding by taking the parameters of void radius and height as random variables. Monte Carlo simulation technique in conjunction with numerical integration is used to calculate the bonding time and its probabilistic distribution. The sensitivity analysis of parameters is then performed to evaluate the effects of creep exponent and surface roughness on the bonding time. Comparison is also made between the theoretical predictions and available experimental results from previous work on Ti-6A1-4V alloy in order to validate the probabilistic model. The proposed model showed a good agreement with the experimental results.
机译：基于结合区域表面光洁度的随机特性，提出了一种预测扩散结合时间的概率模型。通过将空隙半径和高度参数作为随机变量，将表面粗糙度的概率分布引入到扩散结合的确定性模型中。蒙特卡罗模拟技术结合数值积分用于计算键合时间及其概率分布。然后进行参数的敏感性分析，以评估蠕变指数和表面粗糙度对粘合时间的影响。为了验证概率模型，还对理论预测与先前对Ti-6A1-4V合金所做的实验结果进行了比较。提出的模型与实验结果吻合良好。

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