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首页> 外文期刊>Materials Science and Engineering. A, Structural Materials >Influence of the TGO creep behavior on delamination stress development in thermal barrier coating systems
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Influence of the TGO creep behavior on delamination stress development in thermal barrier coating systems

机译：TGO蠕变行为对热障涂层系统中分层应力发展的影响

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摘要

The lifetime of ceramic thermal barrier coatings (TBCs) is significantly affected by the growth of a dense alumina scale at the interface between TBC and the bond coat (BC), the so-called thermally grown oxide (TGO). Occurring growth stresses and thermal expansion mismatch can lead to system failure by spalling and delamination. The evolving stress state depends crucially on BC oxidation kinetics, TGO creep behavior and thermal-mechanical properties of the coating materials. Using a finite element model of a TBC system, the influence of TGO creep on the stress development was studied. The performed calculations consider the effect of TGO grain size, the roughness of the TBC/bond coat interface as well as time and temperature-dependent oxide growth. A high temperature induced sintering of the TBC is also taken into account. The obtained results show an oxidation induced development of compressive stresses above the peaks and of tensile stresses in the valleys of the rough TBC/BC interface. The results indicate that TGO creep can cause a significant stress relaxation above 1050℃ for grain sizes of 0.1 μm. At 1100℃ creep stress relaxation can already be expected for a grain size of 0.3 μm.
机译：陶瓷热障涂层（TBC）的寿命受到在TBC和粘结涂层（BC）之间的界面处的致密氧化铝垢的生长的显着影响，所谓的热生长氧化物（TGO）。发生的生长应力和热膨胀不匹配会导致剥落和分层，从而导致系统故障。不断变化的应力状态主要取决于BC氧化动力学，TGO蠕变行为和涂层材料的热机械性能。利用TBC系统的有限元模型，研究了TGO蠕变对应力发展的影响。进行的计算考虑了TGO晶粒尺寸，TBC /粘结涂层界面的粗糙度以及与时间和温度有关的氧化物生长的影响。还考虑了TBC的高温诱导的烧结。所获得的结果表明，氧化引起的峰顶上方的压缩应力和粗糙的TBC / BC界面的谷部中的拉伸应力的发展。结果表明，对于0.1μm的晶粒，TGO蠕变会在1050℃以上引起明显的应力松弛。在1100℃时，晶粒尺寸为0.3μm的蠕变应力松弛已经可以预期。

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