Plate-like cell growth during directional solidification of a Zn-20wt%Sn high-temperature lead-free solder alloy

著录项

• 来源
  《Materials Science and Engineering》 |2014年第3期|29-36|共8页
• 作者

  Washington L.R. Santos; Crystopher Brito; Jose M.V. Quaresma; Jose E. Spinelli; Amauri Garcia;

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• 作者单位

  Department of Materials Engineering, University of Campinas, UNICAMP, P.O. Box 6122,13083-970 Campinas, SP. Brazil;

  Department of Materials Engineering, University of Campinas, UNICAMP, P.O. Box 6122,13083-970 Campinas, SP. Brazil;

  Federal University of Para, UFPA, Augusto Correa 1,66075-110 Belem, PA. Brazil;

  Department of Materials Engineering, Federal University of Sao Carlos - UFSCar, 13565-905 Sao Carlos, Sao Paulo, Brazil;

  Department of Materials Engineering, University of Campinas, UNICAMP, P.O. Box 6122,13083-970 Campinas, SP. Brazil;

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• 收录信息
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Microstructure; Pb free solder alloys; Zn-Sn solder; Solidification; Hardness;

  机译：微观结构无铅焊料合金;锌锡焊料;凝固;硬度;