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首页> 外文期刊>Materials Science and Engineering. B, Solid-State Materials for Advanced Technology >The effect of the Cr and Mo on the surface accumulation of copper in the electrodeposited Ni-Fe/Cu alloy films
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The effect of the Cr and Mo on the surface accumulation of copper in the electrodeposited Ni-Fe/Cu alloy films

机译：Cr和Mo对电沉积Ni-Fe / Cu合金膜中铜表面累积的影响

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摘要

In the present study, the surface chemical and depth profile composition of the electrodeposited Ni-Fe base alloy layers on the Cu substrates were investigated with compositions of the Ni_(80)-Fe_(20) (binary) and Ni_(77)-Fe_(20.7)-Cr_(1.7)-Mo_(0.6) (quaternary) deposits. Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS) results showed the surface accumulation of copper on the surface layers of binary alloy films in the form of Cu_2O. In the quaternary films, addition of Cr and Mo reduced the amount of the Cu accumulation at the surface, while Cu accumulation was enhanced under air-exposed condition for both alloy films. Depth profiles using the secondary ion mass spectroscopy (SIMS) revealed that in the binary layers, the amount of oxide phases of the Ni-Fe was greater than that quaternary deposit. It is concluded that addition of the Cr and Mo impurities reduced the amount of the copper at the surface layers and oxygen inside the quaternary films.
机译：在本研究中，使用Ni_（80）-Fe_（20）（二元）和Ni_（77）-Fe_的成分研究了电沉积在Cu基体上的Ni-Fe基合金层的表面化学成分和深度轮廓成分。 （20.7）-Cr_（1.7）-Mo_（0.6）（四元）矿床。俄歇电子能谱（AES）和X射线光电子能谱（XPS）结果表明，铜以二元合金Cu_2O形式存在于二元合金膜表面层上。在四元膜中，Cr和Mo的添加减少了表面处的Cu积累量，而两种合金膜在空气暴露条件下的Cu积累均增加。使用二次离子质谱（SIMS）的深度剖面显示，在二元层中，Ni-Fe的氧化物相数量大于四元沉积物。可以得出结论，添加Cr和Mo杂质会减少表面层的铜含量和四级膜内部的氧含量。

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