In situ TEM observation of microcrack nucleation and propagation in pure tin solder

Ying Ding; Chunqing Wang; Mingyu Li; Weiqiang Wang

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In situ TEM observation of microcrack nucleation and propagation in pure tin solder

机译：纯锡焊料中微裂纹成核和扩散的原位TEM观察

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Microcrack nucleation and propagation behavior in pure tin solder was investigated by using transmission electron microscopy (TEM) through in situ tensile test. Observation results showed that fracture process was completed in this visco-plastic material by connecting discontinuous cracks or voids. Depending on remarkable vacancy diffusion ability, microvoids were nucleated and developed in the dislocation free zone (DFZ) or super thinned area ahead of crack tip under local high stress concentration. The cracks were linked with each other by mutual dislocation emission which expedites the propagation of crack tips effectively.

机译：通过透射电子显微镜（TEM）通过原位拉伸试验研究了纯锡焊料中的微裂纹成核和传播行为。观察结果表明，通过连接不连续的裂缝或空隙，这种粘塑性材料完成了断裂过程。根据明显的空位扩散能力，在局部高应力集中时，微空泡在位错自由区（DFZ）或裂纹尖端之前的超薄区域中形核并形成。裂纹通过相互错位发射相互连接，有效地加速了裂纹尖端的传播。

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《Materials Science and Engineering. B, Solid-State Materials for Advanced Technology》 |2006年第1期|p.62-69|共8页
作者
Ying Ding; Chunqing Wang; Mingyu Li; Weiqiang Wang;
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作者单位

Microjoining Laboratory, School of Materials Science and Engineering, Harbin Institute of Technology, 92 Xidazhi Street, Nangang, Harbin, PR China 150001;

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原文格式 PDF
正文语种 eng
中图分类工程材料学;
关键词
pure tin solder; in situ TEM; crack nucleation; crack propagation;

机译：纯锡焊料;原位TEM;裂纹成核;裂纹扩展;

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In situ TEM observation of microcrack nucleation and propagation in pure tin solder

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