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Improved CMOS performance via enhanced carrier mobility

机译:通过提高载流子迁移率来提高CMOS性能

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摘要

The amazing advancements achieved to date in Si complementary metal-oxide-silicon (CMOS) technology have come primarily from scaling, i.e. from reducing the critical dimensions of the transistors. Now that it is increasingly difficult to further reduce critical dimensions, alternative methods of improving transistor performance are also being employed. One important approach is to increase the electron and hole mobility in the transistors. Various approaches for achieving enhanced mobility in CMOS devices are reviewed. Methods for achieving defect-free strained Si structures are discussed.
机译:迄今为止,在Si互补金属氧化物硅(CMOS)技术中取得的惊人进步主要来自缩放,即减小晶体管的关键尺寸。由于越来越难以进一步减小临界尺寸,因此还采用了提高晶体管性能的替代方法。一种重要的方法是增加晶体管中的电子和空穴迁移率。综述了用于在CMOS器件中实现增强的移动性的各种方法。讨论了实现无缺陷应变Si结构的方法。

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