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首页> 外文期刊>Materials Science and Engineering. B, Solid-State Materials for Advanced Technology >Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging
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Effect of volume in interfacial reaction between eutectic Sn-Pb solder and Cu metallization in microelectronic packaging

机译：微电子封装中体积对共晶Sn-Pb焊料与Cu金属化界面反应的影响

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摘要

Eutectic Sn-Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten conventional eutectic Sn-Pb solder having different volumes. BGA solder ball of 760 and 500μm of diameter were used on the Cu pad having a circular area with a diameter of 650μm. A scanning electron microscope was used to measure the consumed thickness of Cu and also the thickness of the intermetallic compound. The soldering reaction was carried out at 190, 200 and 210℃ for 1,5, 10 and 20min. The Cu consumption was much higher for the Sn-Pb solder with higher volume. On the other hand, the mean thickness of the intermetallics for solder with smaller volume was thicker than that of the bigger solder balls. No significant difference was observed of solder volume on the ripening/coarsening flux of soldering reaction. Cu_3Sn compound was also observed at the interface in between Cu_6Sn_5 IMCs and Cu substrate for longer reflow for the smaller solder balls. Larger Cu_6Sn_5 IMCs are observed in the bulk of the solder with bigger volume.
机译：共晶Sn-Pb是历史上最重要的焊料合金，因此其反应将作为无铅焊料替代品的相关参考。这里，已经进行了研究以比较球栅阵列（BGA）衬底的Cu焊盘与具有不同体积的熔融的常规共晶Sn-Pb焊料的溶解动力学。在直径为650μm的圆形区域的Cu焊盘上使用直径为760和500μm的BGA焊球。使用扫描电子显微镜来测量消耗的Cu的厚度以及金属间化合物的厚度。焊接反应在190、200和210℃下进行1.5、10和20分钟。体积较大的Sn-Pb焊料的Cu消耗量高得多。另一方面，体积较小的焊料的金属间化合物的平均厚度比较大的焊料球的平均厚度要厚。在焊接反应的熟化/粗化通量上，没有观察到焊料量的显着差异。在Cu_6Sn_5 IMC和Cu衬底之间的界面处也观察到Cu_3Sn化合物，对于较小的焊球，回流时间更长。在较大体积的焊料中观察到较大的Cu_6Sn_5 IMC。

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