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Influence of material properties upon immobilization of histidine-tagged protein on Ni-Co coated chip

机译:材料性能对组氨酸标签蛋白固定在Ni-Co涂层芯片上的影响

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摘要

In protein research, protein microarray facilitates high-throughput study of protein abundance and function. An appropriate microarray surface that can be used to immobilize protein samples is a prerequisite for the investigation of molecular interactions. Ni-Co alloy coated protein microarray chip has been found to adsorb histidine-tagged proteins effectively based on the method of immobilized metal affinity chromatography. Due to the ingredient of bi-metallic elements, different electroplating conditions resulted in distinct binding affinities. Therefore, the influence of Ni-Co material properties on the immobilization of histidine-tagged protein was systematically investigated in this study. In the experiments, the contact angle measurement suggested that no strong relationship can be established between the wettability of chip surface and its corresponding protein immobilization. ESCA test demonstrated that the major ingredients of the Ni-Co alloy coated protein microarray chip were Ni and Co. In addition, the XRD test concluded that a Ni-Co protein chip that consists mostly of hcp lattice has better binding capability. SEM micrographs provide direct image evidence. These material tests summarize that the Ni-Co alloy coated protein microarray chip adsorbs His-tagged proteins through its surface morphology. Therefore, it can provide specific binding due to the affinity adsorption between the intermediate metals and the protein.
机译:在蛋白质研究中,蛋白质微阵列促进了蛋白质丰度和功能的高通量研究。可用于固定蛋白质样品的合适微阵列表面是研究分子相互作用的先决条件。基于固定化金属亲和层析的方法,发现镍钴合金包被的蛋白质微阵列芯片可有效吸附组氨酸标记的蛋白质。由于双金属元素的成分,不同的电镀条件导致不同的结合亲和力。因此,本研究系统地研究了Ni-Co材料性能对组氨酸标签蛋白固定化的影响。在实验中,接触角测量表明芯片表面的润湿性与其相应的蛋白质固定化之间没有强的关系。 ESCA测试表明,Ni-Co合金包被的蛋白微阵列芯片的主要成分是Ni和Co。此外,XRD测试得出结论,主要由hcp晶格组成的Ni-Co蛋白芯片具有更好的结合能力。 SEM显微照片提供直接的图像证据。这些材料测试表明,Ni-Co合金涂层的蛋白质微阵列芯片通过其表面形态吸收了带有His标签的蛋白质。因此,由于中间金属和蛋白质之间的亲和力吸附,它可以提供特异性结合。

著录项

  • 来源
    《Materials science & engineering》 |2014年第4期|369-373|共5页
  • 作者单位

    Department of Mechanical Engineering, Chung Yuan Christian University, Chung Li 32023, Taiwan,Institute of Biomedical Technology (IBT), Chung Yuan Christian University, Chung Li 32023, Taiwan;

    Department of Mechanical Engineering, Chung Yuan Christian University, Chung Li 32023, Taiwan;

    Department of Mechanical Engineering, Chung Yuan Christian University, Chung Li 32023, Taiwan;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Protein chip; Histidine; Electrodeposition;

    机译:蛋白质芯片;组氨酸;电沉积;

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