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首页> 外文期刊>Materials Science & Engineering. R, Reports >Interfacial reactions between lead-free solders and common base materials
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Interfacial reactions between lead-free solders and common base materials

机译：无铅焊料与普通基材之间的界面反应

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The objective of this review is to study interfacial reactions between pure Sn or Sn-rich solders, and common base metals used in Pb-free electronics production. In particular, the reasons leading to the observed interfacial reactions products and their metallurgical evolution have been analyzed. Results presented in the literature have been critically evaluated with the help of combined thermodynamic-kinetic approach based on the concept of local equilibrium and microstructural knowledge. The following conclusions have been reached: Firstly, the formations of intermetallic compounds in solid/liquid reaction couples are primarily controlled by the dissolution processes of base metals. Other factors that need be considered are the thermodynamic driving force for the formation of intermetallic compounds, their structures and concentration profiles in liquid. Secondly, annealing of solder interconnections in solid state can drastically change the microstructures formed in the solid/liquid reactions, especially if only one of the components in the solder takes part in the interfacial reactions. Thirdly, additional elements can have three major effects on the binary reactions between a base metal and Sn: (ⅰ) they can increase or decrease the reaction/growth rates, (ⅱ) the additives can change the physical properties of the phases formed, and (ⅲ) they can form additional reaction products or displace the binary equilibrium phases by forming new reaction products. Finally, if the local stable or metastable equilibrium is established at the interface, stability information together with kinetic considerations can provide a feasible approach to analyze interfacial reactions, which can have significant impact on the reliability of soldered electronics assemblies.
机译：本文的目的是研究纯锡或富锡焊料与无铅电子产品生产中使用的常见贱金属之间的界面反应。特别是，分析了导致观察到的界面反应产物及其冶金演变的原因。在局部平衡和微观结构知识的基础上，结合热力学-动力学方法，对文献中给出的结果进行了严格的评估。得出以下结论：首先，固/液反应对中金属间化合物的形成主要受贱金属的溶解过程控制。其他需要考虑的因素是金属间化合物的形成的热力学驱动力，其结构和液体中的浓度分布。其次，固态焊料互连的退火会大大改变在固/液反应中形成的微观结构，特别是如果焊料中只有一种组分参与界面反应时。第三，其他元素可能会对贱金属和Sn之间的二元反应产生三大影响：（ⅰ）它们可以提高或降低反应/生长速率，（ⅱ）添加剂可以改变形成的相的物理性质，以及（ⅲ）它们可以形成新的反应产物，或通过形成新的反应产物来取代二元平衡相。最后，如果在界面处建立了局部稳定或亚稳态平衡，则稳定性信息和动力学考虑因素可以为分析界面反应提供一种可行的方法，这可能会对焊接电子组件的可靠性产生重大影响。

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