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首页> 外文期刊>Materials Science Research International >Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel
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Fracture Behavior of HIP Bonded C1100 Copper and SS400 Mild Steel

机译：HIP粘结的C1100铜和SS400低碳钢的断裂行为

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摘要

The fracture behavior of cracks in the vicinity of a HIP diffusion bonded interface between JIS designation SS400 mild steel and C1100 copper was investigated. The cracks were oriented parallel to the diffusion bonded interface and a tensile load was applied in a direction perpendicular to the interface for a range of test temperatures from 20℃ to -180℃. Material dissimilarity led to a complex mode of crack opening, and failure occurred either at the crack or at the material interface depending on the position of the crack relative to the interface and the test temperature. The differences in behavior were investigated using a three-dimensional finite element analysis (FEA). The strain energy density criterion was applied to predict the occurrence and direction of crack propagation by low-stress brittle fracture at extremely low temperatures. It is suggested in this paper that fracture initiation at the interface edge can be predicted based on the total strain energy density in that region.
机译：研究了JIS名称SS400低碳钢和C1100铜之间的HIP扩散粘结界面附近的裂纹的断裂行为。裂纹的取向平行于扩散结合界面，并且在垂直于界面的方向上施加了20℃至-180℃的测试温度范围内的拉伸载荷。材料的不相似导致开裂的模式复杂，并且取决于裂纹相对于界面的位置和测试温度，在裂纹处或在材料界面处均会发生故障。使用三维有限元分析（FEA）研究了行为差异。应变能密度准则用于预测在极低温度下低应力脆性断裂引起的裂纹扩展的发生和方向。本文建议，可以基于该区域的总应变能密度来预测界面边缘处的裂纹萌生。

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