...
  • 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>IEEE / ASME Transactions on Mechatronics >Modeling and Control of Dispensing Processes for Surface Mount Technology
【24h】

Modeling and Control of Dispensing Processes for Surface Mount Technology

机译：表面贴装技术的点胶过程建模与控制

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Dispensing is a key process in surface mount technology (SMT), in which minute amounts of fluid materials (such as solder paste, adhesive) are delivered controllably onto printed circuit boards for the purpose of conducting, bonding, etc. Time-pressure dispensing by means of pressurized air is currently the most widely used approach in SMT. Due to air compressibility, the control of the time-pressure dispensing process has proven to be a challenging task in achieving a high degree of consistency in the amount of fluid dispensed; This paper presents the development of a model of the amount of fluid dispensed by taking air compressibility into account. Based on the model, a control strategy is then developed to improve the consistency in the amount of fluid dispensed. Experiments were conducted to verify the effectiveness of the control strategy.
机译：分配是表面贴装技术（SMT）的关键过程，在该过程中，将微量的流体材料（如焊膏，粘合剂）可控制地输送到印刷电路板上，以进行导电，粘接等目的。压缩空气是目前SMT中使用最广泛的方法。由于空气的可压缩性，时间压力分配过程的控制已被证明是实现分配流体量高度一致性的一项艰巨任务。本文介绍了通过考虑空气可压缩性分配的流体量的模型。基于该模型，然后开发一种控制策略来提高分配的流体量的一致性。进行实验以验证控制策略的有效性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号