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首页> 外文期刊>Metallurgical and Materials Transactions A >Thermal Profiling Using Infrared Thermography in Friction Surfacing
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Thermal Profiling Using Infrared Thermography in Friction Surfacing

机译:在摩擦堆焊中使用红外热成像进行热分析

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摘要

Infrared (IR) thermography was used to measure thermal profiles in the coating, consumable rod, and substrate during friction surfacing. A sudden raise followed by a steady state in thermal profile was observed and attributed to viscous heat dissipation during plastic deformation. The retreating side of the coating experienced higher temperature compared to the advancing side, indicating that the hot plasticized metal is carried from the advancing side to the retreating side.
机译:红外(IR)热成像技术用于测量摩擦堆焊过程中涂层,易损棒和基材中的热分布。观察到热分布突然升高,然后达到稳态,这归因于塑性变形过程中的粘性散热。与前进侧相比,涂层的后退侧经历了更高的温度,这表明热塑化的金属从前进侧被携带到后退侧。

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