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Tin-silver and tin-copper alloys for capillarity joining-soft soldering-of copper piping

机译:锡-银和锡-铜合金,用于毛细管连接-软钎焊-铜管道

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摘要

It is studied the influence of the type of alloy used as filling material on the defects of the soldering joints in copper piping installations, which induce the fluid leak of the systems. The different eutectic temperatures and solidus-liquidus ranges of these alloys, require the Setting of the soldering heat input in each case to obtain the suitable capillarity features And alloying temperatures to achieve for the correct formation of the bondings.
机译:研究了用作填充材料的合金类型对铜管道安装中焊点缺陷的影响,这些缺陷会导致系统的流体泄漏。这些合金的共晶温度和固液相线范围不同,需要分别设置焊接热输入以获得合适的毛细作用和合金化温度,以实现正确的结合。

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