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首页> 外文期刊>Microelectromechanical Systems, Journal of >Split-Frame Gimbaled Two-Dimensional MEMS Scanner for Miniature Dual-Axis Confocal Microendoscopes Fabricated by Front-Side Processing
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Split-Frame Gimbaled Two-Dimensional MEMS Scanner for Miniature Dual-Axis Confocal Microendoscopes Fabricated by Front-Side Processing

机译：用于通过前侧加工制造的微型双轴共聚焦微观镜片的分流框架万向二维MEMS扫描仪

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摘要

In this paper, we introduce a 2-D microelectromechanical systems scanner for 3.2-mm-diameter dual-axis confocal microendoscopes, fabricated exclusively by front-side processing. Compared to conventional bulk micromachining that incorporates back-side etching, the front-side process is simple and thus enables high device yield. By eliminating the back-side etch window, the process yields compact and robust structures that facilitate handling and packaging. An important component of our front- side fabrication is a low-power deep reactive ion etching (DRIE) process that avoids the heating problems associated with standard DRIE. Reducing the RF etch coil power from 2400 to 1500 W leads to elimination of the spring disconnection problem caused by heat-induced aggressive local etching. In our scanner, the outer frame of the gimbal is split and noncontinuous to allow the scanner to be diced along the very edge of the scanning mirror in order to minimize the chip size (1.8 mm × 1.8 mm). The maximum optical deflection angles in static mode are ±5.5° and ±3.8° for the outer and inner axes, respectively. In dynamic operation, the optical deflection angles are ±11.8° at 1.18 kHz for the outer axis and ±8.8° at 2.76 kHz for the inner axis.
机译：在本文中，我们引入了2-D微机电系统扫描仪，用于3.2毫米直径的双轴共聚焦微观镜，专门由前侧处理制造。与包含背面蚀刻的传统散装微机器相比，前侧工艺简单，因此能够实现高器件产量。通过消除后侧蚀刻窗口，该过程产生便于处理和包装的紧凑且稳健的结构。我们的前侧制造的重要组成部分是低功耗深反应离子蚀刻（DRIE）工艺，可避免与标准DRIE相关的加热问题。减少2400至1500W的RF蚀刻线圈功率导致消除由热诱导的积极局部蚀刻引起的弹簧断开问题。在我们的扫描仪中，Gimbal的外框架是分开的，不连续的，以允许扫描仪沿扫描镜的非常边缘切割，以便最小化芯片尺寸（1.8mm×1.8mm）。外部和内轴的静态模式中的最大光学偏转角分别为±5.5°和±3.8°。在动态操作中，光学偏转角为外轴为1.18kHz为1.18kHz，为内轴为2.76 kHz±8.8°。

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