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首页> 外文期刊>Journal of Microelectromechanical Systems >Conductive Blended Polymer MEMS Microresonators
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Conductive Blended Polymer MEMS Microresonators

机译：导电混合聚合物MEMS微谐振器

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摘要

This paper presents an all-polymer microelectromechanical system technology in which a crosslinker is used to modify the electromechanical properties. The structural material of these microelectromechanical systems (MEMS) structures is a poly(3,4-ethylenedioxythiophene)/polystyrene sulfonate/polymethyl methacrylate (PEDOT/PSS/PMMA) blended conductive polymer. Microbridge resonators are fabricated using surface micromachining on glass substrates. The electromechanical properties of the polymer microbridges are studied using electrostatic actuation and optical and electrical detection. The resonance frequency of the polymer bridges occurs in the MHz range, with quality factors of the order of 100 when measured in vacuum. Addition of a silane-based crosslinker increases the Young's modulus of the polymer structural material which is reflected in higher resonance frequency, higher pull-in voltage, better long-term stability of the electrical conductivity, and in a decrease in the quality factor of the resonator. The mechanical properties of the polymer resonators are strongly affected by the residual stress because of the low Young's modulus, and by the measurement frequency and the measurement temperature due to the viscoelastic properties of the polymer structural material.2006-0139
机译：本文提出了一种全聚合物微机电系统技术，其中使用交联剂来修饰机电性能。这些微机电系统（MEMS）结构的结构材料是聚（3,4-乙撑二氧噻吩）/聚苯乙烯磺酸盐/聚甲基丙烯酸甲酯（PEDOT / PSS / PMMA）混合导电聚合物。使用在玻璃基板上进行表面微加工来制造微桥谐振器。使用静电驱动以及光学和电学检测研究了聚合物微桥的机电性能。聚合物桥的共振频率在MHz范围内，在真空中测量时的品质因数约为100。硅烷基交联剂的添加提高了聚合物结构材料的杨氏模量，这反映在更高的共振频率，更高的引入电压，更好的电导率长期稳定性以及聚合物品质因数的降低中。谐振器。聚合物谐振器的机械性能受杨氏模量低的残余应力的影响很大，受聚合物结构材料的粘弹性的测量频率和测量温度的影响很大。2006-0139

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