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首页> 外文期刊>Journal of Microelectromechanical Systems >A Micromachining Process for Die-Scale Pattern Transfer in Ceramics and Its Application to Bulk Piezoelectric Actuators
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A Micromachining Process for Die-Scale Pattern Transfer in Ceramics and Its Application to Bulk Piezoelectric Actuators

机译：陶瓷模具尺寸图案转移的微加工工艺及其在压电驱动器中的应用

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This paper reports on a batch mode planar pattern transfer process for bulk ceramics, glass, and other hard, brittle, nonconductive materials suitable for micromachined transducers and packages. The process is named LEEDUS, as it combines lithography, electroplating, batch mode micro electro-discharge machining (μEDM) and batch mode micro ultrasonic machining (μUSM). An electroplating mold is first created on a silicon or metal wafer using standard lithography, then using the electroplated pattern as an electrode to μEDM a hard metal (stainless steel or WC/Co) tool, which is finally used in the μUSM of the ceramic substrate. A related process (SEDUS) uses serial μEDM and omits lithography for rapid prototyping of simple patterns. Feature sizes of 25 μm within a 4.5 × 4.5 mm{sup}2 die have been micromachined on glass-mica (Macor) ceramic plates with 34 μm depth. The ultrasonic step achieves 18 μm/min. machining rate, with a tool wear ratio of less than 6% for the stainless steel microtool. Other process characteristics are also described. As a demonstration, octagonal and circular spiral shaped in-plane actuators were fabricated from bulk lead zirconate titanate (PZT) plate using the LEEDUS/SEDUS process. A device of 20 μm thickness and 450 μm × 420 μm footprint produces a displacement of ≈2μm at 40 V.
机译：本文报道了批量陶瓷，玻璃以及其他适用于微机械换能器和封装的坚硬，脆性，非导电材料的批量模式平面图案转印工艺。该工艺被称为LEEDUS，因为它结合了光刻，电镀，批处理模式微放电加工（μEDM）和批处理模式微超声加工（μUSM）。首先使用标准平版印刷术在硅或金属晶圆上创建电镀模具，然后将电镀图案用作μEDM硬金属（不锈钢或WC / Co）工具的电极，最终将其用于陶瓷基板的μUSM中。相关工艺（SEDUS）使用串行μEDM并省略了光刻技术，以快速制作简单图案的原型。在厚度为34μm的玻璃云母（Macor）陶瓷板上，对4.5×4.5 mm {sup} 2模具中25μm的特征尺寸进行了微加工。超声步骤达到18μm/ min。加工速度快，不锈钢微型刀具的刀具磨损率小于6％。还描述了其他过程特征。作为演示，使用LEEDUS / SEDUS工艺由块状锆钛酸铅（PZT）板制造了八角形和圆形螺旋形平面致动器。厚度为20μm，占地面积为450μm×420μm的器件在40 V电压下产生的位移约为≈2μm。

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