A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature

Youngjoo Yee; Myoungkyu Park

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A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature

机译：悬浮多晶硅微观结构的黏附模型，包括残余应力梯度和释放后温度

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摘要

A sticking (stiction) model for a cantilevered beam is derived. This model includes the effect of the bending moment, which stems from stress gradient along the vertical direction of structural polysilicon, and the temperature during the release process. The bending moment due to the stress gradient will play an important role in evaluating antisticking efficiency since liquid tension and surface energy of microstructures tend to become smaller by newly developed antisticking techniques. The effects of stress gradient and temperature were analyzed and verified with surface-micromachined polysilicon cantilevers. By modifying the substrate polysilicon with grain-hole formation technique, the effects of residual stress gradient in polysilicon on stiction could be observed in the condition of low work of adhesion.

机译：得出了悬臂梁的粘着（粘滞）模型。该模型包括弯矩的影响，该弯矩是由沿结构多晶硅垂直方向的应力梯度以及释放过程中的温度引起的。由于应力梯度引起的弯矩将在评估防粘效果中起重要作用，因为通过新开发的防粘技术，液体张力和微结构的表面能趋于变小。用表面微机械加工的多晶硅悬臂梁分析并验证了应力梯度和温度的影响。通过用晶孔形成技术对衬底多晶硅进行改性，可以在低粘附力条件下观察到多晶硅中残余应力梯度对静摩擦的影响。

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来源
《Journal of Microelectromechanical Systems》 |1998年第3期|P.339-344|共6页
作者
Youngjoo Yee; Myoungkyu Park;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类自动化系统;微电子学、集成电路（IC）;
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A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature

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