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首页> 外文期刊>Microelectronic Engineering >Fabrication and application of stainless steel stamps for the preparation of microfluidic devices
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Fabrication and application of stainless steel stamps for the preparation of microfluidic devices

机译：用于制备微流体装置的不锈钢印章的制造和应用

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摘要

The use of an electrochemical polishing process to manufacture stainless steel stamps often gives rise to problems: there is a significant release of gas bubbles that can cause the photoresist mask to peel off. In this paper, a new procedure for the manufacture of stainless steel stamps is presented based on a combination of UV-lithography, gold electroplating, and electropolishing techniques. First, the pattern of the stamp is transferred to a photoresist layer by UV-lithography. The pattern in the photoresist is then filled in with a thin layer of gold formed by electroplating. The photoresist is then removed and the substrate etched in an electropolishing bath, with the gold layer serving as an etching mask. The steel stamps were repeatedly tested for the hot embossing of the polymethylmethacrylate substrate. The imprints were used for the preparation of functional microchips to test their functionality, the chips consisting of two polymethylmethacrylate plates: a plate with microchannels was embossed with a steel stamp, and a plate with inlet/outlet holes. The plates were joined by the thermal bonding method and the microchannels of the chip were then filled with a fluorescein solution to test whether the plates were properly bonded. The results indicate that this new procedure is suitable for the fabrication of flexible and durable masters for a roll-to-roll imprinting process.
机译：使用电化学抛光工艺来制造不锈钢印章通常会引起问题：大量气泡的释放会导致光致抗蚀剂掩模剥离。在本文中，提出了一种基于紫外线光刻，电镀金和电抛光技术的不锈钢印章制造新工艺。首先，通过UV光刻将压模的图案转印至光致抗蚀剂层。然后在光致抗蚀剂中的图案上填充一层通过电镀形成的金薄层。然后去除光致抗蚀剂，并且在电抛光浴中对基板进行蚀刻，其中金层用作蚀刻掩模。反复测试钢印模的聚甲基丙烯酸甲酯基底的热压花。压印用于制备功能性微芯片以测试其功能，该芯片由两个聚甲基丙烯酸甲酯板组成：带有微通道的板刻有钢印章，而带有入口/出口孔的板。通过热粘合方法将板连接起来，然后用荧光素溶液填充芯片的微通道，以测试板是否正确粘合。结果表明，该新程序适用于卷对卷压印工艺的柔性和耐用母版的制造。

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