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首页> 外文期刊>Microelectronic Engineering >Laser-assisted ultrathin die packaging: Insights from a process study
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Laser-assisted ultrathin die packaging: Insights from a process study

机译：激光辅助超薄芯片包装：来自过程研究的见解

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摘要

Laser-assisted assembly of ultrathin, ultrasmall bare dice holds promise for enabling a new class of very low cost flexible electronic devices with applications in many areas. But this advanced packaging technology will be of little use if two important parameters are not considered - transfer rate and precision/accuracy of die placement. Both parameters depend on the laser process parameters and the properties of the consumable materials used. Reported are results from a process study designed to investigate the effects of the laser pulse parameters, the adhesive layer properties, and the method of wafer dicing on the transfer rate and placement precision/accuracy when transferring ultrathin (50-um thick) silicon dice using the thermo-mechanical selective laser-assisted die transfer (tmSLADT) technique developed by this team and reported in prior publications. It is shown that, when properly controlled, tmSLADT can transfer ultrathin bare dice with precision and accuracy compatible with those achievable by the conventional die placement methods but at a much higher transfer rate.
机译：超薄，超小裸芯片的激光辅助组装有望使新型超低成本柔性电子设备在许多领域得到应用。但是，如果不考虑两个重要参数-传输速率和管芯放置的精度/准确性，那么这种先进的封装技术将几乎没有用处。这两个参数取决于激光加工参数和所用消耗材料的特性。报告的过程研究结果旨在调查激光脉冲参数，粘合剂层特性以及晶圆切割方法对使用超薄（50微米厚）硅片进行转移时的转移速率和放置精度/精度的影响。该小组开发的热机械选择性激光辅助芯片转移（tmSLADT）技术已在以前的出版物中进行了报道。结果表明，在适当控制的情况下，tmSLADT可以以与传统管芯放置方法可实现的精度和准确性相匹配的精度和准确性来传输超薄裸芯片，但传输速率要高得多。

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  • 来源
    《Microelectronic Engineering》 |2013年第1期|23-30|共8页
  • 作者

    Val R. Marinov; Orven Swenson; Yuriy Atanasov; Nathan Schneck;

  • 作者单位

    Center for Nanoscale Science and Engineering, North Dakota State University, Fargo, ND 58102, USA;

    Center for Nanoscale Science and Engineering, North Dakota State University, Fargo, ND 58102, USA;

    Center for Nanoscale Science and Engineering, North Dakota State University, Fargo, ND 58102, USA;

    Center for Nanoscale Science and Engineering, North Dakota State University, Fargo, ND 58102, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    laser-assisted die transfer; ultrathin bare die; advanced packaging of bare dice;

    机译：激光辅助模具转移;超薄裸片裸骰的高级包装;

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