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A lubrication model between the soft porous brush and rigid flat substrate for post-CMP cleaning

机译：CMP后清洁时，在软质多孔刷和刚性平面基材之间的润滑模型

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摘要

A 3D lubrication model between a soft porous brush and rigid flat surface in the post-CMP (chemical mechanical polishing) cleaning process for wafer or hard-disc surface is set up in this article. The mesh porous structure of the brush and the kinematic relations between the brush and the surface are taken into account. The flow governing equations for cleaning process are deduced with Newtonian fluids between the brush nodule and the substrate. The distributions of fluid pressure and hydrodynamic removal moment are calculated. The simulation results show that the fluid pressure has negative regions in inlet area. The removal force is depended on system parameter, location, time and particle size. The load and hydrodynamic moment increase with the increase of brush velocity and deflection of brush nodule, which is effective for cleaning. A low wafer rotation speed is recommended to keep the cleaning uniformity. The removal moment is increasing during the cleaning process. The hydrodynamic drag force decreases rapidly with decreasing of particle size. The models are coincident with the actual process and can be used as reference for designing a higher level cleaning process and the analysis of the formation of particle defect.
机译：本文建立了在晶片或硬盘表面的CMP（化学机械抛光）后清洗过程中，软质多孔刷和刚性平面之间的3D润滑模型。考虑了刷子的网格多孔结构以及刷子与表面之间的运动关系。用刷子结节和基体之间的牛顿流体推导了清洁过程的流量控制方程。计算了流体压力和流体动力去除力矩的分布。仿真结果表明，流体压力在入口区域具有负向区域。去除力取决于系统参数，位置，时间和粒径。负荷和水动力力矩随着刷子速度的增加和刷子结节的偏转而增加，这对于清洁是有效的。建议保持较低的晶圆转速以保持清洁均匀性。在清洁过程中，去除力矩在增加。随着颗粒尺寸的减小，流体动力阻力迅速减小。该模型与实际工艺相吻合，可作为设计更高水平清洗工艺和分析颗粒缺陷形成的参考。

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  • 来源
    《Microelectronic Engineering》 |2011年第9期|p.2862-2870|共9页
  • 作者

    Yating Huang; Dan Guo; Xinchun Lu; Jianbin Luo;

  • 作者单位

    State Key Laboratory ofTribology, Tsinghua University, Beijing 100084, China,College of Mechanical Engineering, Beijing Technology and Business University, Beijing 100037, China;

    State Key Laboratory ofTribology, Tsinghua University, Beijing 100084, China;

    State Key Laboratory ofTribology, Tsinghua University, Beijing 100084, China;

    State Key Laboratory ofTribology, Tsinghua University, Beijing 100084, China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    hydrodynamics; post-cmp cleaning; particle removal;

    机译：流体动力学;cmp后清洗;去除颗粒;

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