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The dry etching of TEOS oxide for poly-Si cantilevers in supercritical CO_2

机译:在超临界CO_2中干法刻蚀TEOS氧化物用于多晶硅悬臂

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摘要

Dry etching of p-tetraethylorthosilicate (TEOS) with HF/H_2O in supercritical carbon dioxide (scCO_2) was studied. The etch rate of TEOS increased with HF concentration and reaction temperature, while the concentration of H_2O and processing pressure were found to have little effect on the etch rate. Finally, poly-Si cantilevers with high aspect ratios (1:150) were released using this technique without stiction and residue on the surface.
机译:研究了在超临界二氧化碳(scCO_2)中用HF / H_2O干法刻蚀对正硅酸四乙酯(TEOS)。 TEOS的刻蚀速率随HF浓度和反应温度的增加而增加,而H_2O的浓度和处理压力对刻蚀速率的影响很小。最终,使用该技术释放了具有高纵横比(1:150)的多晶硅悬臂,表面上没有附着力和残留物。

著录项

  • 来源
    《Microelectronic Engineering》 |2011年第12期|p.3448-3451|共4页
  • 作者单位

    Department of Imaging System Engineering, Pukyong National University, Busan 608-739, Republic of Korea;

    Department of Imaging System Engineering, Pukyong National University, Busan 608-739, Republic of Korea;

    Department of Imaging System Engineering, Pukyong National University, Busan 608-739, Republic of Korea;

    Department of Physics, Pukyong National University, Busan 608-737, Republic of Korea;

    Department of Semiconductor System, Korea Polytechnic College IV, Cheongju 361-857, Republic of Korea;

    Department of Imaging System Engineering, Pukyong National University, Busan 608-739, Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    etching; sacrificial oxide; poly-si; supercritical carbon dioxide; MEMS; cantilever;

    机译:蚀刻牺牲氧化物多晶硅超临界二氧化碳MEMS;悬臂;

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