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Thermo-mechanical stresses in copper interconnects - A modeling analysis

机译：铜互连中的热机械应力-模型分析

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摘要

This study focuses on numerical modeling of thermo-mechanical stresses in copper interconnects. The three-dimensional analyses utilize a two-level metal structure connected by a via. Attention is devoted to the effects of the incorporation of polymer-based low-k dielectric material. Deformation is generated by thermal strain mismatches during cooling from an elevated temperature, as well as from cyclic thermal excursions. The thin barrier layers encasing the copper are also included in the models. Plastic deformation in the metal is taken into consideration in the analysis. The stress and deformation fields are examined in detail. It is found that the incorporation of low-k dielectric in place of traditional oxide-based dielectric significantly reduces the triaxial tensile stresses in copper but enhances plastic deformation, particularly in the via and its vicinity. The generation of shear stresses at the interface regions is also assessed. A parametric analysis is conducted to elucidate the individual influences of the thermal expansion and elastic properties of the dielectric material. Salient features having direct implications in device reliability are highlighted and discussed.
机译：这项研究的重点是铜互连中热机械应力的数值模拟。三维分析利用通过通孔连接的两层金属结构。致力于结合基于聚合物的低k介电材料的效果。变形是由于在高温下冷却过程中的热应变不匹配以及循环的热偏移而产生的。包含铜的薄阻挡层也包括在模型中。分析中考虑了金属中的塑性变形。详细检查了应力场和变形场。发现以低k电介质代替传统的基于氧化物的电介质可以显着降低铜中的三轴拉伸应力，但可以增强塑性变形，特别是在通孔及其附近。还评估了在界面区域的剪切应力的产生。进行参数分析以阐明介电材料的热膨胀和弹性特性的各个影响。突出和讨论了对设备可靠性有直接影响的显着特征。

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