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Four different approaches for the measurement of IC surface temperature: application to thermal testing

机译:四种不同的IC表面温度测量方法:应用于热测试

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摘要

Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC.
机译:硅芯片表面温度可用于监视数字和模拟集成电路(IC)的健康状态。在本文中,使用四种不同的传感技术:扫描热显微镜,激光反射仪,激光干涉仪和内置的电子差动温度传感器来测量包含热源(热点)的同一IC的表面温度,该热源的行为类似于数字门故障。本文的目的是描述技术,并介绍这些检测方法在IC中热点检测和定位方面的性能。

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