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Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics

机译：断裂力学在塑料封装微电子产品定量加速寿命测试中的应用

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摘要

Accelerated testing must address the failure mechanisms active within the devices undergoing tests in order to assess lifetimes in a meaningful way. The assumption of constant temperature, thermally activated lifetime, based upon the Arrhenius assumptions, does not always provide the necessary understanding to interpret accelerated tests in microelectronics. Plastic encapsulants, dielectric polymers, and underfill materials are subject to delamination and cracking with thermal cycling. Crack propagation during use environment exposure, drives the potential for failure of microelectronic devices and is therefore a necessary focal point in qualification and life testing. This paper reviews the available research in the application of fracture mechanics to this class of problems in microelectronics including relevant test data. In addition, useful acceleration factor models are derived for polymer crack propagation based on principles of linear elastic fracture mechanics. Further, a simple approach to estimating the minimum temperature cycling ranges, necessary to propagate a crack, is also presented. Finally, a methodology of applying acceleration factors to develop testing plans is shown, with an example in spaceflight for a cubesat in low Earth orbit. Overall, this is a paper that shows a useful and appropriate process for creating physics of failure based life testing for delamination and cracking failures in microelectronic polymers in a temperature cycling environment.
机译：加速测试必须解决正在测试的设备中活动的故障机制，以便以有意义的方式评估寿命。基于阿伦尼乌斯（Arrhenius）假设的恒定温度，热激活寿命的假设并不总能提供必要的知识来解释微电子学中的加速测试。塑料密封剂，介电聚合物和底部填充材料会因热循环而分层和破裂。在使用环境中暴露的裂纹扩展会引发微电子设备故障的可能性，因此是鉴定和寿命测试中的必要重点。本文综述了断裂力学在微电子学这类问题中的应用研究，包括相关的测试数据。此外，基于线性弹性断裂力学原理，得出了用于聚合物裂纹扩展的有用加速因子模型。此外，还提出了一种简单的方法来估算传播裂纹所需的最小温度循环范围。最后，展示了一种应用加速因子来制定测试计划的方法，并举例说明了在低地球轨道上的立方体卫星的太空飞行实例。总体而言，这是一篇论文，显示了一种有用且适当的过程，可用于创建基于故障的寿命测试的物理原理，以对温度循环环境中微电子聚合物的分层和破裂故障进行测试。

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