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Uncertainty analysis of solder alloy material parameters estimation based on model calibration method

机译：基于模型标定法的焊料合金材料参数估计不确定度分析

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摘要

Quantification of the uncertainties in the material characterization of solder joint has been one of the major concerns in the microelectronics packaging industry to predict fatigue failure accurately. Therefore, in this study, a model calibration method based on Bayesian approach is proposed to quantify these uncertainties arising in the material parameter estimation of the solder alloy. A specimen is fabricated to this end, which closely simulates solder joint behavior of the actual package under a thermal cycle. Experiment is conducted to examine the deformation by using Moire interferometry. Viscoplastic finite element analysis procedure is constructed for the specimen based on the Anand model. The uncertainties which include inherent experimental error and insufficient data of experiments are addressed by using the likelihood estimation. Two materials, one being conventional solder of Sn36Pb2Ag and the other the lead-free solder of Sn3.0Ag0.5Cu, are considered to illustrate the approach. As a result, material parameters are identified in the form of credible interval (CI), and the displacements and strains using these parameters are given by the predictive interval (PI). The results suggest that the proposed approach can be a useful tool in the probabilistic estimation of the unknown material parameters of solder joint by accounting for the uncertainties due to the experimental data.
机译：量化焊点材料特性中的不确定性一直是微电子包装行业准确预测疲劳失效的主要问题之一。因此，在这项研究中，提出了一种基于贝叶斯方法的模型校准方法来量化在焊料合金的材料参数估计中出现的这些不确定性。为此，制作了一个样品，该样品紧密模拟了实际封装在热循环下的焊点行为。通过使用莫尔干涉仪进行实验以检查变形。基于Anand模型，为样本建立了粘塑性有限元分析程序。使用似然估计可以解决包括固有实验误差和实验数据不足在内的不确定性。考虑两种材料，一种是Sn36Pb2Ag的常规焊料，另一种是Sn3.0Ag0.5Cu的无铅焊料，以说明该方法。结果，材料参数以可信区间（CI）的形式识别，并且使用这些参数的位移和应变由预测区间（PI）给出。结果表明，通过考虑实验数据带来的不确定性，所提出的方法可以作为概率估计焊点未知材料参数的有用工具。

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  • 来源
    《Microelectronics reliability》 |2012年第6期|p.1128-1137|共10页
  • 作者

    Jin Hyuk Gang; Dawn An; Jin Won Joo; Joo Ho Choi;

  • 作者单位

    School of Aerospace and Mechanical Engineering, Korea Aerospace University, 100 Hanggongdae-gil, Hwajeon-dong, Deokyang-gu, Goyang-city, Gyeonggi-do 412-791,Republic of Korea;

    School of Aerospace and Mechanical Engineering, Korea Aerospace University, 100 Hanggongdae-gil, Hwajeon-dong, Deokyang-gu, Goyang-city, Gyeonggi-do 412-791,Republic of Korea;

    Department of Engineering Mechanics, Chungbuk National University, 410 Seongbong-ro, Heungdeok-gu, Cheongju-city, Chungbuk 361-763, Republic of Korea;

    School of Aerospace and Mechanical Engineering, Korea Aerospace University, 100 Hanggongdae-gil, Hwajeon-dong, Deokyang-gu, Goyang-city, Gyeonggi-do 412-791,Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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