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Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

机译：电子包装用可焊接导电胶（ECA）的特性

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摘要

This study investigated the effect of the viscosity of the ECAs using a low-melting-point alloy (LMPA) filler on its bonding characteristics. The curing behaviors of the ECAs were determined using Differential Scanning Calorimetry (DSC), and ECA temperature-dependant viscosity characteristics were observed using a torsional parallel rheometer. The wetting test was conducted to investigate the reduction capability of ECAs and the flow-coalescence-wetting behavior of the LMPAs in ECAs. Electrical and mechanical properties were determined and compared to those with commercial ECAs and eutectic tin/lead (Sn/Pb) solder. In the metallurgically interconnected Quad Flat Package (QFP) joint, a typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper SnBi/Cu interface after curing process. On the other hand, a (Cu, Ni)_6Sn_5 IMC layer formed on the SnBi/ENIG interface. In addition, the fracture surface exhibited by cleavage fracture mode and the fracture was propagated along the Cu-Sn IMC/SnBi interface. The extremely low-level viscosity of ECAs had a significant influence on the flow-coalescence-wetting behavior of the LMPAs in ECAs and also on the interconnection properties. Stable interconnected assemblies showed good electrical and mechanical properties.
机译：这项研究调查了使用低熔点合金（LMPA）填料的ECA粘度对其粘结特性的影响。使用差示扫描量热法（DSC）确定ECA的固化行为，并使用扭转平行流变仪观察ECA的温度依赖性粘度特性。进行润湿测试以研究ECA的还原能力和LMPA在ECA中的流动凝聚润湿行为。确定了电气和机械性能，并与商业ECA和共晶锡/铅（Sn / Pb）焊料进行了比较。在冶金互连的四方扁平封装（QFP）接头中，固化工艺后，在上部SnBi / Cu界面处形成了典型的扇贝型Cu-Sn金属间化合物（IMC）层。另一方面，在SnBi / ENIG界面上形成了（Cu，Ni）_6Sn_5IMC层。另外，断裂面表现出分裂断裂模式，并且断裂沿Cu-Sn IMC / SnBi界面传播。 ECA的极低粘度对ECPA中LMPA的流动聚结-润湿行为以及互连特性具有重大影响。稳定的互连组件显示出良好的电气和机械性能。

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  • 来源
    《Microelectronics reliability》 |2012年第6期|p.1165-1173|共9页
  • 作者

    Byung-Seung Yim; Yumi Kwon; Seung Hoon Oh; Jooheon Kim; Yong-Eui Shin; Seong Hyuk Lee; Jong-Min Kim;

  • 作者单位

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea;

    School of Chemical Engineering & Material Science, Chung-Ang University, Seoul 156-756, Republic of Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea;

    School of Chemical Engineering & Material Science, Chung-Ang University, Seoul 156-756, Republic of Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea;

    School of Mechanical Engineering, Chung-Ang University, Seoul 156-756, Republic of Korea,Chung-Ang University, 221 Heusksuk-dong,Dongjak-gu, Seoul 156-756, Republic of Korea;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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