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Evaluation of creep properties for Sn-Ag-Cu micro solder joint by multi-temperature stress relaxation test

机译：通过多温度应力松弛试验评估Sn-Ag-Cu微焊点的蠕变性能

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摘要

The creep properties of a Sn-Ag-Cu micro solder joint with a solder ball with 500 urn were investigated by a multi-temperature stress relaxation test performed using a specimen at three temperatures (298, 348, and 398 K). The stress exponents in Norton's law were 8 at 398 K, 8.8 at 348 K, and 9 at 298 K, and the activation energies were found to be 39 kJ/mol in the high-stress region and 80 kj/mol in the low-stress region. The stress exponent in Norton's law for a micro solder joint was lower than that for a large-scale specimen, which resulted in more coarsened intermetallics in the microstructure than in the large-scale specimen. The activation energies for the micro solder joint were almost equal to those for the large-scale specimen in the high- and low-stress regions. These results reflect the microstructure of the micro solder joint, and the creep constitutive equation for the Sn-Ag-Cu joint could be derived by the multi-temperature stress relaxation test proposed in this study.
机译：通过在三个温度（298、348和398 K）下使用样品进行的多温度应力松弛测试，研究了具有500 n的焊球的Sn-Ag-Cu微焊料接头的蠕变性能。诺顿定律的应力指数在398 K时为8，在348 K时为8.8，在298 K时为9，高应力区的活化能为39 kJ / mol，低应力区的活化能为80 kj / mol。应力区。在诺顿定律中，微型焊点的应力指数低于大型试样的应力指数，这导致显微组织中的金属间化合物比大型试样更粗糙。微焊点的活化能几乎与高应力和低应力区域中的大型试样的活化能相同。这些结果反映了微焊点的微观结构，并且可以通过本研究提出的多温度应力松弛试验来得出Sn-Ag-Cu焊点的蠕变本构方程。

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  • 来源
    《Microelectronics & Reliability》 |2012年第7期|p.1435-1440|共6页
  • 作者

    Yoshihiko Kanda; Yoshiharu Kariya;

  • 作者单位

    Graduate School of Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, Japan;

    Department of Materials Science and Engineering, Shibaura Institute of Technology, 3-7-5 Toyosu, Koto-ku, Tokyo 135-8548, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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