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Standard Gives Guidance For Alloy Conversion Using Hot-solder Dip

机译：标准为使用热焊浸胶的合金转化提供指导

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The Restriction of Hazardous Substances (RoHS) legislation that has led to an essentially global ban on the use of solders containing lead in electronics production, permitted exemptions for military, aerospace, and a few other users who still needed to use leaded solders. After a brief interval, component manufacturers converted virtually all of their components to lead-free solders such as Tin-Silver-Copper SAC, leaving those with exemptions with no source for components for tin-lead solder.rnThe need for these components gave impetus to a niche industry whose business was using hot solder dipping to remove the pure tin finish from the component termi-rnnations, and refinishing the finish with tin-lead solder. One basic requirement is that all of the pure tin must be removed to avoid tin whisker growth. To do this, the component's terminations must be dipped in hot tin-lead solder right up to the body of the component.
机译：有害物质限制（RoHS）立法已导致在全球范围内禁止在电子产品生产中使用含铅焊料，允许军事，航空航天和其他一些仍需要使用含铅焊料的用户豁免。短暂的间隔后，元件制造商几乎将其所有元件都转换为无铅焊料，例如锡银铜SAC，从而使那些没有豁免的锡铅焊料组件没有来源。rn对这些组件的需求推动了一个利基行业，其业务是使用热浸锡从组件终端中去除纯锡涂层，并使用锡铅焊料对涂层进行修补。一个基本要求是必须除去所有纯锡，以避免锡晶须生长。为此，必须将组件的端子浸入热锡铅焊料中，直至组件的主体。

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