3D integration advances computing

Reda Sherief

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3D integration advances computing

机译：3D集成促进了计算

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Integrated circuits usually have only one layer of electronic devices, which limits their performance and functionality. A 3D integrated circuit that incorporates multiple device layers enables a wealth of applications. See Letter p.74

机译：集成电路通常只有一层电子设备，这限制了它们的性能和功能。包含多个设备层的3D集成电路可实现大量应用。见第74页

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来源
《Nature》 |2017年第7661期|38-40|共3页
作者
Reda Sherief;
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作者单位

Brown Univ, Sch Engn, Providence, RI 02912 USA|Brown Univ, Dept Comp Sci, Providence, RI 02912 USA;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);美国《化学文摘》(CA);
原文格式 PDF
正文语种 eng
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机译：Centip3De：探索3D集成和近阈值计算的多核原型
2. Advances in 3D imaging and volumetric reconstruction of fluid and melt inclusions by high resolution X-ray computed tomography [J] . Richard Antonin, Morlot Christophe, Creon Laura, Chemical geology . 2019,第期

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3. Recent advances in 3D computed tomography techniques for simulation and navigation in hepatobiliary pancreatic surgery. [J] . Masafumi Uchida Journal of hepato-biliary-pancreatic sciences . 2014,第4期

机译：3D计算机断层扫描技术在肝胆胰外科手术中模拟和导航的最新进展。
4. How 3D integration technologies enable advanced compute node for Exascale-level High Performance Computing? [C] . D. Dutoit, P. Coudrain, P.-Y. Martinez, International Electron Devices Meeting . 2020

机译：3D集成技术如何启用Exascale级高性能计算的高级计算节点？
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6. Metal artefact reduction for patients with metallic dental fillings in helical neck computed tomography: comparison of adaptive iterative dose reduction 3D (AIDR 3D) forward-projected model-based iterative reconstruction solution (FIRST) and AIDR 3D with single-energy metal artefact reduction (SEMAR) [O] . Koichiro Yasaka, Kouhei Kamiya, Ryusuke Irie, 2016

机译：螺旋颈CT术中具有金属牙填充物的患者的金属假象减少：自适应迭代剂量减少3D（AIDR 3D）基于正向模型的基于模型的迭代重建解决方案（FIRST）和具有单能金属假象减少的AIDR 3D的比较（ SEMAR）
7. 3D integration advances computing [O] . Sherief Reda 2017

机译：3D集成进步计算

3D integration advances computing

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