机译:力诱导机械响应性聚合物材料中共价键的活化
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
The Beckman Institute, University of Illinois at Urbana-Champaign, Illinois 61801, USA School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore (J.Y.) Department of Chemistry, Stanford University, Stanford, California, USA (T.J.M.);
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA The Beckman Institute, University of Illinois at Urbana-Champaign, Illinois 61801, USA Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA The Beckman Institute, University of Illinois at Urbana-Champaign, Illinois 61801, USA School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore (J.Y.) Department of Chemistry, Stanford University, Stanford, California, USA (T.J.M.);
The Beckman Institute, University of Illinois at Urbana-Champaign, Illinois 61801, USA Department of Aerospace Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
Department of Chemistry, University of Illinois at Urbana-Champaign, Illinois 61801, USA The Beckman Institute, University of Illinois at Urbana-Champaign, Illinois 61801, USA Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
The Beckman Institute, University of Illinois at Urbana-Champaign, Illinois 61801, USA Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Illinois 61801, USA;
机译:机械响应发光胶束在玻璃和聚合物在水性条件下的共价结合
机译:动态共价尿素键及其开发自愈聚合物材料的潜力
机译:聚合物材料中的动态共价键
机译:具有聚合物材料的多壁碳纳米管的共价和非共价官能化
机译:利用可逆共价键和氢键的自适应聚合物纳米材料。
机译:根据表面处理和粘结材料复合树脂与高性能聚合物PEKK的剪切粘结强度
机译:用动态共价键的机械光学交联剂增强的聚(Nhexyl甲基丙烯酸酯)软质材料的能量耗散和力学颜色评价
机译:使用可逆共价键的可修饰聚合物材料