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Non-destructive testing of Cu solder connections using active thermography

机译：使用主动热成像技术对Cu焊料连接进行无损检测

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摘要

Impulse and lock-in thermography have been applied to detect delaminations of prototype solder joints, similar to those to be produced between Cu shunts and Cu busbar stabilisers at the Large Hadron Collider (LHC) at CERN. Two infrared cameras with different detector materials and with different spectral ranges and two excitation techniques have been tested and compared for their ability to detect delaminations behind 2 and 3 mm thick Cu shunts. We have analyzed the signal to noise ratio (SNR) for each detected defect and are able to detect defects down to a nominal edge length of 4 mm behind 2 mm thick Cu shunts by using fast impulse thermography and a camera with a microbolometer array. For the 3 mm thick Cu shunt, on the other hand, the nominal 4 mm defect is only visible in the lock-in thermography phase images and the highest SNR has been achieved with a cooled InSb-based camera. In addition, numerical simulations show the influence of the minimum detectable defect size on the shunt thickness and that the developed on-site testing technique is sufficient to find all defects that are detectable theoretically.
机译：脉冲和锁定热成像技术已用于检测原型焊点的分层，类似于CERN大型强子对撞机（LHC）的分流器和铜母线稳定器之间产生的分层。测试了两种具有不同检测器材料，具有不同光谱范围和两种激励技术的红外摄像机，并比较了它们检测2毫米和3毫米厚铜分流器后的分层的能力。我们已经分析了每个检测到的缺陷的信噪比（SNR），并且能够通过使用快速脉冲热成像技术和带有测微辐射热计阵列的摄像机，在2 mm厚的铜分流器之后检测到标称边缘长度低至4 mm的缺陷。另一方面，对于3毫米厚的铜分流器，仅在锁定热成像相位图像中可见4毫米标称缺陷，并且使用基于InSb的冷却相机实现了最高SNR。此外，数值模拟显示了最小可检测缺陷尺寸对分流器厚度的影响，并且开发的现场测试技术足以发现理论上可检测的所有缺陷。

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  • 来源
    《NDT & E international》 |2012年第2012期|p.103-111|共9页
  • 作者

    Christiane Maierhofer; Mathias Roellig; Henrik Steinfurth; Mathias Ziegler; Marc Kreutzbruck; Christian Scheuerlein; Simon Heck;

  • 作者单位

    BAM Federal Institute for Materials Research and Testing, Division 8.4, Unter den Eichen 87, D-12205 Berlin, Germany;

    BAM Federal Institute for Materials Research and Testing, Division 8.4, Unter den Eichen 87, D-12205 Berlin, Germany;

    BAM Federal Institute for Materials Research and Testing, Division 8.4, Unter den Eichen 87, D-12205 Berlin, Germany;

    BAM Federal Institute for Materials Research and Testing, Division 8.4, Unter den Eichen 87, D-12205 Berlin, Germany;

    BAM Federal Institute for Materials Research and Testing, Division 8.4, Unter den Eichen 87, D-12205 Berlin, Germany;

    CERN European Organization for Nuclear Research, CH-1211 Geneva 23, Switzerland;

    CERN European Organization for Nuclear Research, CH-1211 Geneva 23, Switzerland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    active thermography; solder joint; copper; FFT; signal-to-noise-ratio;

    机译：主动热成像焊点铜;FFT;信噪比;

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