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Millimeter-Wave MMICs with Quarter-Micron Au/WSi Gate AlGaAs/InGaAs HJFETs

机译:具有四分之一微米Au / WSi栅极AlGaAs / InGaAs HJFET的毫米波MMIC

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Millimeter-wave MMICs (Microwave Monolithic ICs) having quarter-micron T-shaped (Au/WSi) gate AlGaAs/InGaAs Heterojunction FETs (HJFETs) have been developed for the first time. The quarter-micron length gate was successfully formed by 0.45 μm photolithography technology by employing the silicon dioxide inner side-wall technique and the ECR (Electron Cyclotron Resonance) etching technology. In order to reduce drain-to-gate parasitic capacitance, we removed the dielectric film (SiO_2) between the cap of the T-shaped gate and the channel layer. The f_(max) of 170 GHz was achieved for 100 μm gate width device. An output power of 23 dBm was obtained with a linear gain of 12 dB for a prototype 2-stage MMIC at 40 GHz band, with high reliability.
机译:首次开发出具有四分之一微米T形(Au / WSi)栅极AlGaAs / InGaAs异质结FET(HJFET)的毫米波MMIC(微波单片IC)。通过使用二氧化硅内侧壁技术和ECR(电子回旋共振)蚀刻技术,通过0.45μm光刻技术成功形成了四分之一微米长的栅极。为了减少漏极到栅极的寄生电容,我们去除了T形栅极盖和沟道层之间的介电膜(SiO_2)。对于100μm栅极宽度的器件,可以达到170 GHz的f_(max)。对于40 GHz频段的原型2级MMIC,获得了23 dBm的输出功率和12 dB的线性增益。

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