• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>NTT R&D >TRENDS IN OPTICAL INTERCONNECTION TECHNOLOGIES AND THEIR IMPACT ON NEXT-GENERATION EQUIPMENT PACKAGING
【24h】

TRENDS IN OPTICAL INTERCONNECTION TECHNOLOGIES AND THEIR IMPACT ON NEXT-GENERATION EQUIPMENT PACKAGING

机译：光学互连技术的发展趋势及其对下一代设备包装的影响

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

An interconnection crisis is expected in the next-generation information systems, such as massively parallel computers and large-capacity ATM switches. Optical interconnections, instead of metal wiring, are the most promising way to overcome the expected bottleneck in electronic interconnections. The penetration of optical interconnections will inevitably force packaging technologies to evolve. This paper overviews the advantages of optical interconnections and their impact on packaging technologies in each hierarchy from chip packaging to physical design of equipment. Hot topics among NTT's ongoing activities, such as a 28-Gbit/s-throughput parallel optical interconnect module "ParaBIT", an optical active connector, and a novel photonics-intensive-packaging system "ρ -PAS", are also presented.
机译：下一代信息系统（例如大规模并行计算机和大容量ATM交换机）将面临互连危机。光学互连而不是金属布线是克服电子互连中预期瓶颈的最有前途的方法。光学互连的渗透将不可避免地迫使封装技术发展。本文概述了光互连的优势及其在从芯片封装到设备物理设计的各个层次中对封装技术的影响。还介绍了NTT正在进行的活动中的热门话题，例如28 Gbit / s吞吐量的并行光学互连模块“ ParaBIT”，光学有源连接器和新型光子密集包装系统“ρ-PAS”。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号