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Belle Ⅱ SVD ladder assembly procedure and electrical qualification

机译：BelleⅡSVD梯子的组装程序和电气鉴定

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摘要

The Belle Ⅱ experiment at the SuperKEKB asymmetric e~+ e~- collider in Japan will operate at a luminosity approximately 50 times larger than its predecessor (Belle). At its heart lies a six-layer vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle Ⅱ is time-dependent CP violation asymmetry, which hinges on a precise charged-track vertex determination. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision three dimensional coordinate measurements of the jigs used in assembly as well as of the final SVD modules.
机译：日本SuperKEKB不对称e〜+电子对撞机的BelleⅡ实验的发光度约为其前身（Belle）的50倍。它的核心是六层顶点检测器，包括两层像素化硅检测器（PXD）和四层双面硅微带检测器（SVD）。 BelleⅡ的关键度量之一是与时间有关的CP违规不对称性，它取决于精确的带电轨迹顶点确定。为了实现这一目标，应正确组装SVD组件并精确对准，并应检查其几何公差是否在设计极限之内。我们将概述正在遵循的组装程序，包括SVD模块组件的精确粘合，各种电气组件的引线键合以及组装中使用的夹具的精确三维坐标测量以及最终的SVD模块。

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